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We developed a high-speed (20 Gbps/channel) and large-capacity (1 Tbps/board) optical printed circuit board with a proposed two-lens optical coupling structure and a low-power (7.1 mW/Gbps) optical module using a CMOS IC, and successfully demonstrated 20-Gbps/ch operation in our optical interconnection.
We propose a flexible opto-electronic circuit board (FOECB) for in-device interconnection, which is combined with a flexible printed circuit (FPC) with flexible optical waveguides having 45deg mirrors for 90deg beam turning using adhesive film. The fabricated prototype shows total optical loss of 3.7 dB, and the prototype, which mounted a 4-ch vertical-cavity surface-emitting laser (VCSEL) array and...
A multilayer optical printed wiring board with a cube-core structure was developed for high-density optical interconnections. A fabricated multilayer optical printed wiring board with this cube-core structure has optical-coupling efficiency 2.7 dB higher than one without this structure. A fabricated optical interconnection model successfully demonstrated 10-Gbit/s/channel operation. These results...
The purpose of this study was to analyze the drop reliability of solder joints in assembled IC package on print wiring board (PWB) from viewpoint of structure of test equipment. Considering reliability of mobile devices, it was important to establish the drop reliability for solder joints. In this paper, the repetitive drop test with simple equipment was carried out to evaluate the drop reliability...
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