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Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. Numerical modeling can provide more fundamental understanding of these failure phenomena. As a results, predicting, and ultimately, preventing these phenomena will result in an increased reliability of current and future electronic products. In this paper, delamination phenomena occurring...
Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. This is caused by the following technology and business trends: (1) increasing miniaturization, (2) introduction of new materials, (3) shorter time-to-market, (4) increasing design complexity and decreasing design margins, (5) shortened development and qualification times, (5) gap between...
Thermo-mechanical reliability issues have been identified as major bottlenecks in the development of future microelectronic components. This is caused by the following technology and business trends: (1) increasing miniaturisation, (2) introduction of new materials, (3) shorter time-to-market, (4) increasing design complexity and decreasing design margins, (5) shortened development and qualification...
A new method was developed for modeling electronic packages. The method is applied to a BGA 256 on board. The simulation results were compared to measured results of a thermal cycle test and a thermal shock test. The methodology has shown to be accurate and efficient. This work also shows that thermal transient behavior must be considered in situations where high gradients can occur, like thermal...
The continuous industry drive for miniaturization and function integration forces the development of feature sizes down to the nanometer regime. Although the industry has just solved the major problems in CMOS090 technology, a new hurdle is to be taken: CMOS065. And again, new materials will be introduced. Black Diamond-I, used in CMOS090, will be replaced by Black Diamond-II(x). This new material...
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