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The need for EMI shielding is becoming more pronounced as it is driven by miniaturization of devices, higher bandwidth of market needs, multiple applications on the same device, and heightened safety concerns with regard to the threat of electromagnetism to the health of users. In this paper, we present a reliable method for thin film coating on the surface of a molding compound by nickel and copper...
Conformal plating on mold compound is a new fabrication process technology, it offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sinking, 3D circuit patterning and EMI shielding. This fabrication technology had successfully demostrated a process which is able to achieve high reliable performance, as being proven to have high peeling strength...
Plating on molding compound is a relatively new field whichcould open up new package designs. One major application is conformal self EMI shielding (package level shielding) of ICs. Generally, EMI shielding is done mainly by metallic cans, however, this technique increases the space requirements and reduces flexibility of component layout on the PCB, that would not be suitable to handset products...
In this paper a glass-copper interface adhesion promoting thin film is described that forms chemical bonds with glass, and mechanically and possibly chemically anchors to copper to create strong, reliable adhesion between the glass substrate and the deposited metal. Wet chemical deposition of a low volatile organic content (VOC), emissions free, cost-effective, water based coating solution was used...
Plating on molding compound is a relatively new field which could open up new package designs. One major application is conformal self EMI shielding (package level shielding) of ICs. Generally, EMI shielding is done mainly by metallic cans, however, this technique increases the space requirements and reduces flexibility of component layout on the PCB, that would not be suitable to handset products.
This paper introduces a new wet chemical surface preparation process for plating on molding compound. The approach is based on an innovative combination of mechanical anchoring by selective etching and chemical adhesion. Plating on molding compound substrates is a relatively new field with many possible applications. One major application is magnetic or electrical magnetic shielding of active components...
An economical and reliable copper metallization of dimensionally stable, non-conductive substrates, such as glass and ceramic, is becoming a major focus in electronic packaging technologies. Conventionally, adhesion on these substrates is achieved either by sputtering a thin metallic adhesive (Ti, Cr) followed by a copper seed layer or by high temperature lamination. This study has demonstrated that...
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is desirable. Conventional metal plating techniques, however fail tape test. This paper studies the condition of...
This paper aims to introduce a new wet chemical process for adhesion enhancement of plated metal to epoxy molding compounds (EMC). The approach is based on an innovative combination of mechanical anchoring and chemical adhesion. The new approach broadens possible application ranges and replaces more limited processes such as sandblasting and sputtering, which have cost and technical drawbacks.
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