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This paper reports on modeling and analysis of power delivery network (PDN) impedance and switching noise in through silicon via (TSV)-based 3-D integration. PDN is simulated in SPICE with the combination of lumped-element models and distributed-element models, where the elements are extracted from full-wave electromagnetic modeling. PDN impedance explicitly distinguishes the contributions from off-chip...
This paper reports on modeling of simultaneous switching noise (SSN) in power distribution network (PDN) for 3D systems, where multiple IC chips are stacked and connected by through-silicon vias (TSVs). The noises generated by current switching during the transition from idle state to active state are analyzed with both on-chip and off-chip PDNs. SSN is decomposed into different frequency components...
This paper reports on power delivery modeling for 3D systems where through-silicon vias (TSVs) are not uniformly distributed, but are arranged at the peripheries of circuit blocks and die edges. The voltage drop (IR) and di/dt noise on the power delivery are modeled and compared with those given by uniformly distributed TSVs. The impact of TSV density and circuit block size, and their tradeoffs are...
To ensure that citrus picking robot operates safely in complex natural scenes, the branches must be recognized to prepare for avoiding obstacle and path planning. Due to the complexity of natural environment and the deficiency of identifying branches by the traditional methods, five narrow band filters in the Vis-NIR region were selected to capture five images. The first four principal component images...
Through-strata-via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. This paper reports on TSV crosstalk performance under high speed operations using a 3D electromagnetic field solver and a SPICE simulator in both the frequency domain and time domain. Impacts of the rise time, the TSV pitch/height, the substrate resistivity and the guarding TSV termination on crosstalk...
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