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In the current mobile electronics market, there is a great demand of electronics products with better performance, smaller foot print and greater package functionality with a lower manufacturing cost. Smart phones and tablets are some of the portable electronics devices that require more functions, smaller form factor and reduced power consumption requirements [1]. To address these requirements, the...
With the perpetual demand for greater functionalities, better performance and greater energy efficiency at cheaper manufacturing cost and smaller form factor, Fan-Out Wafer Level Packaging (FOWLP) technology has emerged as one of the most promising technology in fulfilling the demands from electronic devices for mobile and network applications. In our FOWLP mold-first approach development work, we...
In this paper, a successful assembly of the two guest dies on the large size (38.7 mm × 26.7 mm) through silicon interposer (TSI) and 45mm × 45mm size organic substrate was achieved. The warpage at different steps of the proposed assembly flow: Chip-on-Chip (CoC) first, then CoC on Substrate (CoC-oS) was measured by the shadow moiré method. The warpage simulation model was also developed and validated...
In flip chip technology, flux is widely used to clean the surface of the solder bumps and the surfaces to be soldered for good wetting of the solder bumps on the conductive bond pads [1]. Moreover, flux helps to keep the flipped chip in position and hold it during die placement and the subsequent reflow process. However, this flux-containing reflow can cause problems and inconveniences. For example,...
In recent years, tremendous research and attention have been focused on 2.5D/3D IC (integrated circuit) integration within a TSI (Through Silicon Interposer) package. Integration of multiple ICs with the use of TSI technology could bring about higher integration density, shorter interconnection path and smaller device structure for the next-generation semiconductor devices. In this paper, we investigated...
In this paper, the drop impact reliability of the 3D embedded wafer level package (eWLP) was studied by the experiment and finite element simulation. The drop impact reliability test of the 3D eWLP test vehicle was conducted under the loading of 1500 g within 0.5 ms. The failure mechanisms were identified through the failure analysis experiment. The experimental results show that the failure modes...
The use of portable electronic devices like smart phones and tablets results in high demand for more function, smaller dimensions and reduced power consumption requirements. To meet these challenges, electronic package design uses thinner chips with fine pitch bumping. There is active development in 2.5D and 3D IC packages with through silicon via (TSV). Tighter interconnection in addition to the...
In order to improve the reliability of the proposed test vehicle of the Package on Package (PoP) with Embedded Wafer Level Package (eWLP) using through mold via (TMV) as vertical interconnect. In this paper, the solder joint reliability of eWLP PoP package was studied by the thermo-mechanical finite element simulation under the −40 °C to 125 °C thermal cycle loading conditions. The simulation results...
Currently PoP (Package on Package) has become a main stream of 3D integration for logic devices such as baseband and application processors with high performance memory in mobile application. This PoP has an advantage of a smaller package size with high functionality due to stacking of two different packages. However a conventional PoP with PCB substrate has a limitation to meet the recent requirement...
The use of flip-chip technology in packaging interconnects is becoming more important due to its better electrical performance, smaller form factor packages, and higher interconnect density than wire bonded packages. Flipchip soldering has been the mainstream flip-chip technology. However, the move towards fine pitch Cu pillar flip chip packaging with fine pad bond pitch has driven the investigation...
The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip-chip technology are suitability for very fine pitch interconnection and fluxless bonding. Fluxless flip-chip assembly is in demand especially for medical applications and optoelectonics...
In this paper, we present the findings of a feasibility study to understand the impact of process and materials interaction in Pb-free flip chip package of 65nm Cu/low-k device. The concerns pertaining to Cu/low-k packaging were evaluated with successful demonstration of existing baseline assembly processes for low-k packaging. Several underfill materials were also evaluated in terms of processability...
Flip chip assembly using non-conductive adhesives (NCAs) and anisotropic conductive adhesives (ACAs) is gaining importance and acceptance in electronics packaging industry. For this packaging technology, a variety of material combinations is possible involving different bump types and adhesives. One of the challenges is to select a robust flip chip joint configuration to meet desired reliability requirements...
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