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This paper presents an optimum interstage matching inductor of a cascode amplifier by formulation, for the first time. The formulation clarifies capacitances of FETs which degrade a gain of the cascode amplifier. The inductive matched cascode LNA fabricated by 90nm CMOS performs 25.6 dB gain with NF of 6 dB and output P1dB of −2.3 dBm at 60GHz while consuming 26.9 mW.
A 60GHz band 3-dimensional (3-D) phased array antenna module has been fabricated and hetero-plane beam synthesis is demonstrated. Two separated 2×2 end-fire dipole array antennas in different (z-y and z-x) planes are configured in a multi-stacked substrate module. For x-direction, z-y plane array antenna is used and for y-direction, z-x plane array antenna is used. In order to achieve higher antenna...
In order to extend the communication range of the 60-GHz band broadband communication system, beam forming technology has been introduced. Due to the relatively high insertion loss and high phase/amplitude errors of 60-GHz band radio frequency (RF) phase shifter, broadband base band (BB) phase shifter has been focused. In this paper, we have developed a beam forming CMOS receiver RF integrated circuits...
<?Pub Dtl?>A 60-GHz band planar dipole array antenna structure in a small wireless terminal is proposed for wide coverage area beamforming applications. Several substrates are stacked vertically by using 3-D system-in-package (SiP) technology, and the element antenna is installed on the substrates. A planar dipole antenna is used as an element antenna because it has a wider bandwidth than conventional...
A novel planar type broadband balun having a symmetrical structure has been proposed. Considering a lossless and uniform material, balun operation is analyzed and impedance matching condition is formulated. Applying the proposed balun configuration, and using CMOS multi-layer structure, a CMOS on-chip balun has been fabricated. The fabricated balun has achieved ultra-broadband performance. Measured...
A low cost, ultra small antenna integrated wireless transceiver is one of the key technologies for short range millimeter-wave wireless communication. A RF module with integrated antenna will be presented. It consists of low cost organic multi-layer substrates and MMICs. The substrates are vertically stacked by employing Cu ball bonding 3-D system in package (SiP) technology and MMIC's are mounted...
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