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An energy-efficient radio SoC with RF front-end, DBB (digital baseband) and MCU (microcontroller) for medical/healthcare applications in 315/400 MHz bands is presented. The SoC is fully-compliant with IEEE 802.15.6 standard in 402–405MHz MICS (Medical Implant Communication Service) band and 420–450MHz ISM (Industrial, Scientific, and Medical) band, and also supports a proprietary mode with a high...
To implement a true wirelessly connected brain-machine interface (BMI) system, we have to consider two main aspects: circuit design and device fabrication. The circuit should be designed so as to implement many functionalities including neural recording/stimulation and wireless connection with ultralow-power operation. The fabricated devices are passive elements such as a nano/micro electrode array...
In-band interferers due to noise coupling from baseband digital circuits significantly impact on the wireless communication performance, in the case of single-chip system-level integration. The on-chip and off-chip (on-board) noise coupling are measured for visualizing the noise couplings. In addition, the hardware-in-the-loop simulation (HILS) estimates their impacts on the performance metrics like...
Bluetooth and Bluetooth Low Energy are one of the most popular wireless standards for short range communications. One of the key features is low power operation to minimize form factor of sensor nodes including battery in the Internet-of-Things (IoT) era. Our latest Bluetooth Low Energy SoC achieves −92 dBm receiver sensitivity with 6.3 mA peak current consumption. Transmitter maximum output power...
IoT applications such as healthcare monitoring systems, need a lot of wireless terminal solutions with low power consumption. The key is how to use the RF terminal solutions easily for general purpose users. To compromise these user requirements, a new adaptable RF MCU of Bluetocth® Smart has been developed as our top-line products Using the leading-edge 40nm-process technology with a sliding intermediate...
This paper introduces a quadrature modulation transmitter featuring the new IF-based quadrature backscattering technique to yield spectral efficient modulation schemes while reducing the power consumption. A 5.8 GHz RF-powered transceiver with the proposed transmitter was fabricated in 65 nm Si CMOS technology. The transmitter achieves 2.5 Mb/s, 32-QAM modulation while consuming 113 μW under 0.6 V...
This paper reviews recent digitally calibration and I\Q mismatch compensation techniques. A number of approaches have been reported to improve the circuit performance and enhance the system robustness. All these built-in self-calibration and auto-switching functions are innovated to pave the road to the next-generation millimeter-wave 5G mobile smart RFIC.
This paper presents a hot-carrier injection (HCI) healing technique with a 60GHz wireless transceiver in 65nm CMOS. The transceiver is capable of 16QAM wireless communication with a data rate of 7Gb/s. The damaged output power can be recovered to 7.8dBm by the proposed HCI-healing technique, and an 81-year lifetime is achieved.
In this paper, we present a broadband frequency doubler with harmonic rejection using 90nm CMOS process. The balanced frequency doubler adopts cascode topology with class C bias to maximize second order harmonic generation. An elliptic low pass filter is integrated inside the cascode structure to suppress the fourth and higher order harmonic power. The 3-dB bandwidth of this frequency doubler is from...
This paper presents an optimum interstage matching inductor of a cascode amplifier by formulation, for the first time. The formulation clarifies capacitances of FETs which degrade a gain of the cascode amplifier. The inductive matched cascode LNA fabricated by 90nm CMOS performs 25.6 dB gain with NF of 6 dB and output P1dB of −2.3 dBm at 60GHz while consuming 26.9 mW.
This paper presents a 57–66GHz 6-bit switch type phase shifter fabricated in 65nm CMOS technology. The proposed phase shifter achieves a 6-bit resolution and a measured root mean square phase error of less than 2.3°, while the maximal insertion loss flatness is ±1.4dB. For all 64 states, the insertion loss is −20dB±3dB including pad loss over 57–66GHz. To the best of our knowledge, this is the first...
This paper presents a low-cost and broadband bondwire interconnect for chip-to-chip and chip-to-carrier communications. Four transmission lines and three signal bondwires form a three-path interconnect structure which can greatly reduce the bondwire effect. Ground bondwires are also carefully deployed to have good ground connection between chips or chip and carrier. An interconnect from a 0.18-μm...
This paper describes the design and measurement of a quad-band low noise receiver front-end module. It consists of a quintplexer and receiver front-end ICs. The quintplexer is consisted of a low loss triplexer fabricated using low temperature co-fired ceramic (LTCC) technology, a commercial duplexer, and a commercial band-pass filter. The receiver front-end ICs were fabricated using 0.25 μm SiGe BiCMOS...
This paper presents an integrated configuration of patch antennas and low-profile filters for a front-end module in a Massive-MIMO transmitter on 5G era. It is very important for the Massive-MIMO transmitter to build thin and light-weight equipment from the viewpoint of easy installation. However, in general, conventional filters used in base station transmitters are large and heavy-weight, which...
TransferJet™ is an emerging high-speed close-proximity wireless communication standard, which enables a data transfer of up to 522 Mbps within a few centimeters transmission range. We have designed a fully integrated TransferJetTM SoC with a 4.48-GHz operating frequency and a 560-MHz signal bandwidth using a 65 nm CMOS technology. A module has also been developed employing 3D integration technology...
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