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Addressable transistor arrays (∼20,000 devices) provide an attractive test vehicle to study TSV/FET proximity effects in a statistically meaningful way. FET/TSV proximity effect studies have been performed at the 45 nm node using a dense addressable parametric diagnostic (APD). We have found that a carefully designed TSV integration sequence at this node has minimal impact on the quality of devices...
This paper reviews the recent progress in temporary wafer handling technologies for 3D/2.5D wafer integration. Several critical factors in the selection of a temporary wafer handler technology for 3D/2.5D integration will be discussed and some recommendations are made.
Energy consumption is a dominant constraint on the performance of modern microprocessors and systems-on-chip. Dynamic voltage and frequency scaling (DVFS) is a promising technique for performing “on-the-fly” energy-performance optimization in the presence of workload variability. Effective implementation of DVFS requires voltage regulators that can provide many independent power supplies and can transition...
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