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This paper demonstrates that our very thin film STO capacitor can be located under re-distribution layer (RDL) of WLP/FO-WLP package and is effective for reduction of the power supply noise of LSIs. Their Shmoo plots show improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our Sub-RDL STO thin film capacitors.
This paper demonstrates that our Die-Attached STO thin film decoupling capacitor is effective for reduction of the resonant power supply noise of LSIs. Shmoo plots shows improvement of operable frequency and power supply voltage reduction, as results of the improved power integrity realized by our STO thin film capacitors.
This paper demonstrates an on-die STO thin film decoupling capacitor used for resonant power supply noise reduction. The on-die STO capacitor consists of STO whose dielectric constant is about 20 and is sandwitched by Cu films in an organic interposer on which we can also draw connection wires by Cu deposition. The capacitor was attached directly on our test chip using ball banding technique through...
In this paper, we demonstrate our STO thin film decoupling capacitor embedded in organic interposer is effective for reduction of resonant power supply noise of LSI. By comparison of Shmoo plots with on-chip MOS capacitor, significant contributions of STO capacitor to higher operable frequency and lower power supply voltage are shown.
For closer positioning of capacitors to LSI, we have developed a process for lamination of thin film capacitors made of strontium titanate (SrTiO3, STO) onto organic substrates of 30µm thin. The thin film capacitors can be mounted on to surface of board at very low height, and we have fabricated glass interposer with these technologies. In this paper, our development work on fabrication process for...
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