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Fine pitch copper (Cu) pillar bump adoption has been growing in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities. Assembling such packages using...
Cu Column bump has seen growing adoption in both high-end and low-cost mobile devices as well as in consumer, computing and networking devices. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bump on lead (BOL), while higher performance requirements are driving increased current densities, thus making electromigration...
The adoption of Tablet devices within the mobile communication space and its penetration into the market segment once held by laptops has resulted in explosive growth rate of these devices, and as a result has created new requirements for the packaging of Application Processors (AP) used in these devices. These requirements and trends are similar to those seen within the Smartphone space and include...
In this paper, we describe a study in which the thermal performance data of Theta jc (Rth-JC), Theta ja (Rth-JA), and structure functions of a flip-chip ball grid array device with heat spreader, fcBGA-H, was measured. For Rth-JC, various boundary conditions for the thermal resistance modeling were considered and are discussed here. A transient measurement method was used to obtain the temperature...
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