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For electroplated Sn and Sn alloy finishes, one of the reliability concerns remains the risk of whisker growth. Results from recent work have suggested that whiskers are most likely to form in regions of the films where high stress or a stress gradient exists. If strain/stress distribution information can be collected at a grain-by-grain level, correlations between such information and the propensity...
The conversion to Pb-free solders has already been implemented in the consumer market. However, the transition to Pb-free solders in the high performance, mission critical networking/server industry has not yet been fully implemented. A significant factor in the slow transition to Pb-free solders is the absence of industry accepted Pb-free acceleration transforms that can translate lab test results...
A custom SRAM was developed for high performance and high reliability network switching applications using 90 nm low-k silicon technology. It is a 13.6 mm x 18.4 mm flip chip chip scale package (CSP) with a 11.12 mm x 16.36 mm die. The package has 838 BGA balls at 0.5 mm pitch. The 0.5 mm ball pitch CSP minimizes electrical package parasitics and enables higher data rate performance. However, the...
Manufacturability and reliability of a custom CSP SRAM mounted on an interposer is discussed in this paper. In order to provide a reliable device for high reliability applications, an SRAM interposer structure was designed to ensure high reliability on every level of solder joint interconnects. Finite element modeling method was used as a mean to evaluate the reliability of various configurations...
Mechanical integrity of interlayer and intralayer dielectric films and its impact on interconnect reliability has become more important as critical dimensions in ultralarge-scale integrated circuits are continuously reduced and Cu interconnect, low-k dielectrics (Cu/low-k) are widely adopted for the new technology nodes. Mechanical integrity of the dielectric films and reliability of interconnect...
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