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To meet the requirements of the next high generation high-performance networking switches and routers, system integration based on the Three-dimensional (3D) System-in-Package (SiP) technology is being studied and developed. In this paper, we report the development of a 3D SiP using the organic interposer technology. A 3D SiP is designed and manufactured with a large size organic interposer with fine-pitch...
To enable three-dimensional (3D) ASIC and memory integration, large-size silicon interposer is a critical technology [1]. Currently most silicon interposers are manufactured by wafer foundries and are limited in size by the wafer lithographic processing. In this study, manufacturing of cost- and performance-effective, large-size silicon interposers are investigated. The existing supply chain and infrastructure...
The bandwidth for high performance networking switches and routers increases two to ten times in every new generation. This in turn drives the bandwidth requirements for the Application Specific Integrated Circuits (ASICs) and their external memory devices designed for the high performance network systems. 3D IC integration with its low power, high density and high bandwidth advantages is proposed...
High end networking and computing applications continue to drive silicon technologies for higher data rates and increased bandwidth. The push for silicon performance with 45nm and 32nm devices also drives a need for packaging performance to deliver clean and efficient power to the device. This paper compares the electrical performance, assembly and reliability of various advanced packaging technologies,...
High end networking and computing applications continue to drive silicon technologies for higher data rates and increased bandwidth. The push for silicon performance also drives a need for packaging performance to deliver clean and efficient power to the device. This paper compares the electrical performance of three new advanced packaging technologies designed to improve the DC and AC power delivery...
High end computing and networking applications continue to drive silicon technologies for higher performance, increased bandwidth and frequency. The drive for higher performance has resulted in increased power dissipation. A method for mitigating power dissipation includes reducing the voltage but unfortunately the consequence is reduced noise margin. This paper evaluates the electrical performance...
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