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Power and power density increase in microelectronics is a major challenge for packaging high performance ASIC and microprocessor devices. The thermal interface material (TIM) used between the chip and the heat spreader of the Flip Chip Plastic Ball Grid Array (FC-PBGA) package plays a very important role in the package thermal performance. Not only does it affect package thermal performance, it can...
Manufacturability and reliability of a custom CSP SRAM mounted on an interposer is discussed in this paper. In order to provide a reliable device for high reliability applications, an SRAM interposer structure was designed to ensure high reliability on every level of solder joint interconnects. Finite element modeling method was used as a mean to evaluate the reliability of various configurations...
For specific applications, there can be significant performance advantages when using a SiP (system in package). With the proper silicon functional partitioning, well controlled interconnect medium, and well tuned interface design; the data bandwidth can be increased by both speed and width. The disadvantages of SiPs are increased risks in reliability, manufacturability, and difficulty with test access,...
Reliability of the flip-chip plastic ball grid array (FC-PBGA) packages is highly dependent on the properties of the constituent components and the interface formed between them. The relative mechanical compliances and thermal mismatch between the silicon chip, the underfill material and the organic laminate substrate are particularly important to the design and performance the package. Strong coupling...
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