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Increasing demand for advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies. Memory bandwidth has become a bottleneck to mobile processor performance and lower power consumption for high performance computing needs. To reduce...
Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven semiconductor industry to develop more innovative and emerging advanced packaging technologies.
Memory bandwidth has become a bottleneck to processor performance for tera-scale computing needs. To reduce this obstacle, a revolution in package technologies is required for tera-scale computing requirements. 3D TSV (Through Silicon Via) stacking is believed to be one of the technologies that can meet those requirements. In advanced 3D stacking technologies, one of the important steps is to develop...
Demand for Through Silicon Via (TSV) is being driven by the need for 3D stacking to shorten interconnection length, increase signal speed, reduce power consumption and reduce power dissipation. Increasing demand for new and more advanced electronic products with a smaller form factor, superior functionality and performance with a lower overall cost has driven the semiconductor industry to develop...
Bonding of multiple indium-silver intermediate layers facilitates precise control of the formed alloy composition and the joint thickness. The bonding temperature and post-bonding re-melting temperature can thus be easily designed by controlling the multilayer materials and structure thicknesses. However, joining different materials involves the formation of intermetallics, which is known to be brittle...
This paper is for process development of assembly technologies used to fabricate the 3-D silicon carrier system-in-package (SiP). The five assembly technologies are wafer thinning, thin flip chip attach on silicon carrier, ultra low loop wire bonding, glass cap fabrication and sealing, and silicon carrier stacking. The developed SiP has three silicon carriers with four flip chip and one wire bond...
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