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Illicium verum extract is investigated as a corrosion inhibitor of aluminium in the presence of an acid medium using gravimetric and impedance techniques. The gravimetric results reveal that the adsorption of inhibitor on the metal surface is physisorption. The impedance measurements are used to interpret the electrochemical process occurring at the interface of aluminium and corrosive medium. The...
Copper wire bonding process has become popular interconnection process over gold because of its obvious cost advantages as well as lower electrical resistivity and good thermal conductivity. Recently, Pd-coated Cu wire is emerging as an alternative to bonding with bare Cu wire to prevent copper oxidation during the bonding and improve manufacturability [1]. Compared to bare copper, Pd copper wire...
Copper wire bonding offers several mechanical and electrical advantages as well as cost saving compared to its gold wire predecessor. In the recent years, driven by the increasing price of gold, copper wire material and copper wire bonding process are widely researched for the high end IC packaging in the IC assembly area. In this paper, characterization work has been done in order to understand how...
When developing new MAPBGA package, package delamination was found after 96hrs autoclave test (121C, 100%RH, 15psig) through CSAM check and cross section analysis. MSL 3, 260C preconditioning was performed before the autoclave test. The improvement study was made on substrate power/ground gold ring design, substrate copper metal roughness and substrate metal layer design. Finally, the package delamination...
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