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This paper describes the design, simulation, construction process and experimental analysis of a microgripper, which makes use of a new concept hinge, called CSFH (Conjugate Surfaces Flexure Hinge). The new hinge combines a curved cantilever beam, as flexible element, and a pair of conjugate surfaces, whose contacts depend on load conditions. CSFH hinges improve accuracy and guarantee that minimum...
In this work we report the application of the selective wet processing technique based on dynamic liquid meniscus for copper pillar bumps (CPB) plating. The industrial plating of copper for CPB process is typically carried out at 2 μm/min. A much higher copper deposition rate is necessary to improve throughput for this process. To achieve higher deposition rates of copper the hydrodynamic issue that...
A new plane parallel micro-manipulator is presented in this paper, together with the numerical procedure that has been used in order to optimize some kinetostatic performance indices, among which the kinematic condition number and the mechanical advantage. The approach is based on a refined simplification of the direct kinematic problem and it is applied to the pseudo-rigid body model of the original...
The need of micromanipulation devices has been growing rapidly during the last decades, specially in the fields of Biology and Micro-Assembly, and many solutions have been proposed to cope with the increasing demand. The present paper suggests a possible way to micromanipulating objects in various conditions, adopting MEMS technologies to develop a microgripper based on a new flexural hinge, recently...
Silicon interposer technology offers System-In-Package (SiP) and System-On-Package (SoP) designers the unique possibility of achieving 3D integration without the need to implement Through-Silicon-Via (TSV) structures in active silicon, contributing to overall cost reduction of the final product. Silicon interposers require both horizontal and vertical interconnections, to redistribute the signals...
Electroporation is an effective method to deliver drugs into tumor cells to kill them, by applying a pulsed electric field to the cellular membrane [1, 2]. Existing electrodes consist of clamping claws or arrays of needles and can be effectively applied only to small areas. New electrodes that can treat large areas are sought; flexibility is needed to adapt to irregular tumor shape and, to be folded...
In this work it is described an high-density contacting technology that can replace wire bonding in power electronic applications, to overcome known limitation of bond wires liftoff occurring after several power cycles due to the difference in the coefficient of thermal expansion of silicon and aluminum. In the presented technology, MEMS (micro-electro-mechanics systems) micro-fabrication processes...
Most power electronic modules are specifically designed for the customer and this entails intense labour during the production phase. The monolithic integration for power electronic devices in the form of power IC has not proven to be efficient, neither from a technical, nor from an economic point of view. In a typical high power module the power devices are assembled on a heatsink and, driver, sensor...
Microrobots are used nowadays in several fields of application, specially in mini invasive surgery. However, they are rather difficult to be constructed, and the traditional micro machining tools are not adequate yet to built the smaller parts. The construction of the microrobots is even harder if more than one D.O.F. are required for the mechanism, because these systems are more complicated. This...
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