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Due to its remarkable properties, carbon nanotube (CNT) was widely used in different areas, especially in electronic packaging for the improvement of the adhesion and thermal conductivity. CNT as an emerging thermal interface material (TIM) is now widely used to improve thermal dissipation in electronic packaging. CNT array as TIM is suffering from poor adhesion between CNTs and substrate in packages...
Due to its remarkable properties, carbon nanotube (CNT) was widely used in different areas, especially in electronic packaging for the improvement of the adhesion and thermal conductivity. CNT as an emerging thermal interface material (TIM) is now widely used to improve thermal dissipation in electronic packaging. CNTs suffer from moisture or high interfacial stresses from the mismatch of the thermal...
The present study was focused on the investigation of effect of defects on the CNT thermal performance. In order to investigate effect of defects on the material properties of the CNT, MD models were built using the Materials studio software (Accelrys, Inc). In this study, a series of MD models were built to simulate the effect of defects on thermal performance of the SWCNT. Based on Fourier's law,...
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