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Wafer Level Chip Scale Packaging (WLCSP) designs, including Wafer Level Fan-Out (WLFO) technologies, are gaining more and more applications for next generation small and thin devices. Since the WLCSP and WLFO packages are mounted directly on the motherboard without a substrate as a buffer, the large coefficient of thermal expansion (CTE) mismatch between the silicon die and the motherboard makes the...
The tremendous growth in smartphones and tablets has been fueled by consumer demand for increased mobility, functionality, and ease of use. This, in turn, has been driving an increase in functional convergence and 3D integration of integrated circuit (IC) devices, resulting in the need for more advanced and sophisticated packaging techniques. In particular, the integration of the application processor...
An experiment is conducted to study failure mechanism during flip chip attach process for Cu Pillar bumped Si device that uses mass reflow assembly technology. A three-leg design of experiment (DOE) is conducted, which includes two UBM sizes, two different Cu pillar height, and with / without polyimide option to collect basic failure information. Finite element software is used to correlate the failure...
Coreless substrates have been used in more and more advanced package designs for their benefits in electrical performance and reduction in thickness. However, coreless substrate causes severe package warpage due to the lack of a rigid and low CTE core. In this paper, both experimental measured warpage data and model simulation data are presented and illustrate that asymmetric designs in substrate...
For the first time, a microwave intermodulation technique is used to measure the mechanical resonance directly on packaged and unpackaged RF MEMS capacitive switches with quality factors approaching unity due to air damping. The result is validated by similar measurements in vacuum with much higher quality factors. From the measured resonance frequencies, the residual mechanical stress of the fixed-fixed...
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