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With the increased use of mobile phones, navigation systems, PDA's, laptop's and portable gaming devices the drop reliability of microelectronics has become an important parameter. Assessing the solder interconnect quality by means of drop impact testing, as standardized by e.g. JEDEC, during normal production requires considerable amounts of time and effort. Besides this, the repeatability of the...
A common failure during the lifetime of most mobile devices is failure through dropping. This is nowadays tested by means of the drop impact test, which has been standardized by JEDEC. This method however takes quite some time and has some problems regarding reproducibility. This paper reports the work done on correlating the drop impact test with the cold bump pull that might be a replacement. The...
Interest has been growing in monitoring the ongoing health of systems and products in order to predict failures, provide warning to avoid catastrophic failures, reduce life-cycle costs and enhance their operational efficiency. This paper reviews the current state-of-the-art techniques and innovations of health monitoring of microelectronics using contactless testing. The paper explains the conventional...
Thermo-mechanical reliability issues are major bottlenecks in the development of future microelectronic components. This is caused by the following technology and business trends: (1) increasing miniaturization, (2) introduction of new materials, (3) shorter time-to-market, (4) increasing design complexity and decreasing design margins, (5) shortened development and qualification times, (5) gap between...
Since the last 2-4 years, the focus in microelectronics is gradually changing from front-end to packaging. More added values are put into packages, where System in Packages (SiP) is an answer for the ongoing function integration trend. In SiP several dies are placed into one package, either side-by-side or on top of each other. The miniaturization trend more or less forbids placing dies side-by-side,...
Nowadays, one of the trends of microelectronic packaging is to integrate multiple functional systems into one package, resulting in more applications of multimaterials in the form of laminated thin films or stacks. As a consequence, the number of interfaces increases. This causes tremendous mechanical problems, for instance interfacial delamination. Prediction of interface delamination is typically...
A new method was developed for modeling electronic packages. The method is applied to a BGA 256 on board. The simulation results were compared to measured results of a thermal cycle test and a thermal shock test. The methodology has shown to be accurate and efficient. This work also shows that thermal transient behavior must be considered in situations where high gradients can occur, like thermal...
The continuous industry drive for miniaturization and function integration forces the development of feature sizes down to the nanometer regime. Although the industry has just solved the major problems in CMOS090 technology, a new hurdle is to be taken: CMOS065. And again, new materials will be introduced. Black Diamond-I, used in CMOS090, will be replaced by Black Diamond-II(x). This new material...
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