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Moisture sensitivity of packages is an area of great concern for the electronics industry. The differential swelling of materials in a non-hermetic package during manufacture, handling, storage, assembly, and then also during its lifetime can cause stresses large enough to damage the package. A moisture automation analysis system is developed based on ANSYS Workbench and Excel platform in this paper...
The technology of thermal analysis is very important in development of a new generation of IC package design, which aims to obtain the temperature distribution and thermal resistance of package. Most IC design engineers and package engineers have many difficulties in performing thermal analysis because they are familiar with the product structure but poor in thermal-physical modeling and FEA skills...
Thermal simulation and analysis play a significant role in development of new generation of IC package design. However, in general IC design engineers and package engineers do not have the skills of performing such simulation and analysis. One way of overcoming tins problem is to develop a tool which can perform thermal analysis on package models automatically. Based on tins idea, a customized tool...
Thermal simulation and analysis become increasingly vital with rapidly increases of packaging density of IC chips. However, in general, IC design engineers and package engineers do not have the skills of performing such simulation and analysis. One way of overcoming this problem is to develop a tool which can perform thermal analysis on package models automatically. Based on this idea, a customized...
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