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3D chip stacking technology has the potential to enable increased system performance through integration of heterogeneous system components, such as accelerators and high density memory, as well as through increased area for tightly integrated processor components in multi-core systems. This paper describes the design, measurements and a thermal modeling methodology used to achieve accurate 3D thermal...
Since faults in wind turbine transmission chains would reduce the efficiency of generated power, accurate power generation performance (PGP) evaluation is necessary for the economic use of wind energy and reasonable arrangement of maintenance plan. However, the harsh environment and illegal operations lead the PGP difficult to evaluate. In this paper, a robust statistical method which combines Gaussian...
To calculate the scalar dissipation rate in the non-premixed turbulent combustion different formulations for the conditional scalar dissipation rate are deducted. The scalar dissipation rate is an extremely important parameter in the turbulent combustion, since it alone accounts for effects of turbulent strain and stretch and represents the inverse of a characteristic diffusion time and as such it...
Radiative losses are known to play an important role in the development of hydrodynamic instabilities in many astrophysical (Core-collapse supernovae; HH objects) and laboratory (Inertial confinement fusion) environments. The fielding of triple-annular gas-puff valves on university level pulsed-power generators [1][2] enables study of these instabilities in carefully controlled environments, for inviscid...
A new type of CO2 laser resonator with hole-coupling output is presented in this paper. The laser beam in the resonator is focused into the reflector assembly system composed of a reflector with a small central hole and an output mirror with a central coupling hole. According to the theory of diffraction optics, the laser optical field distribution in the cavity and the far-field distribution are...
The reliability of complex interconnect structures at all levels of the chip integration hierarchy has become a major concern due to the use of fine feature sizes, diverse materials, and complex 3D architectures. Reliability issues range from stress related failures such as dielectric cracking and interface debonding during manufacturing to electrical and mechanical failures such as electromigration...
In order to improve the safety of potentially hazardous situations such as "hot" disconnections of equipment or deteriorated connections, a deeper knowledge of the characteristics of the arcs thus produced and their subsequent damage to contact materials, insulating and wiring, is needed. Numerous studies have been performed on DC arcs as they appear in automotive applications. There is...
A linear transconductance stage with process insensitive gain control and gain insensitive output offset current is proposed. A calibration scheme to remove the LO feedthrough (LOFT) and I/Q imbalance is also introduced. The prototype achieves 3rd-order IMD suppression better than 52dBc, LOF suppression better than 32dBc, and image rejection better than 46dBc for all gain settings. The transmit chain...
In this paper is reported for the first time a rigorous physically based ion implantation damage model which successfully predicts both the as-implanted impurity profiles (SIMS) and the damage profiles (RBS) for a wide range of implant conditions for arsenic, boron and BF/sub 2/ implants. In addition, the amorphous layer thicknesses predicted by this new damage model for high dose implants are also...
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