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A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb, designated as Indalloy276, was developed targeting for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature range of 223 to 232°C, reflowable at profile with peak temperature 245°C and 255C, with ambient temperature Yield stress 60MPa, UTS 77 MPa, and ductility 28%, and a higher stress than both...
For SiP or SMT assembly process, solder paste has been the choice of primary soldering material. In the meantime, miniaturization has been the trend of electronic industry. While the size of components, pads, stencil thickness, aperture, pitch, and solder powder has been shrinking continuously so far, it is about time to ask whether the solder paste technology is able to support this trend forever...
Due to the global trend of green manufacturing, lead-free becomes the main stream soldering choice of electronic industry. SnAgCu alloys are the prevailing choices, with SnCu(+Y), SnAg(+Y), and BiSn(+Y) families also being adopted, where Y represents minor additive elements. The soldering processing window is narrower than that of Sn63, mainly due to the elevated melting temperature of SnAgCu solder...
For harsh electronics environments, where some applications (e.g., automotive and defense) require operating temperatures at 150 °C or higher, the Pb-free SnAgCu (SAC) solders such as Sn3.0Ag0.5Cu (SAC305) and Sn3.8Ag0.7Cu (SAC387) alloys are not reliable enough to replace the high-Pb, high melting temperature solders. Harsh environment electronic industries that are currently exempted from RoHS regulations...
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step...
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. SnPb was included as a control. The findings are as follows: (1)...
Thermal fatigue and room temperature isothermal mechanical performance of various Pb-free and SnPb solder joints were examined. Various solder alloys doped with Ni (SN100C) and Mn (SAC105-Mn and SACM) were evaluated and compared to SAC105, SAC 205 SAC 305 and SAC 405 and eutectic SnPb alloys. Solder spheres ranging from 10 to 20 mils were reflowed on various printed circuit board (PCB) surface finishes...
Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. SnPb was included as a control. The findings are as follows: (1)...
98.5Sn0.5Ag1Cu0.05Mn (SAC0510M) exhibits a melting behavior similar to SAC105. It is two times better than SAC105 in the dynamic bending test; more than 8 times better in the modified JEDEC drop test; and more than 40–60% better in the −55°C/125°C thermal cycling test. The reduced hardness and much thinner and stable IMC layer on Ni are responsible for the superior non-fragility, while the stabilized...
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step...
Reliability has been a critical issue for thermal interface materials, especially when the materials are used for high power applications. In this paper, a series of reliability tests including baking, humidity chamber, temperature cycling, power cycling, and thermal shock have been conducted. Through comparison with conventional thermal pastes or phase change materials, a novel thermal paste with...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for some test...
In this study, the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions against eutectic SnPb, SAC105, and SAC305 alloys. The Mn or Ce doped low cost SAC105 alloys achieved a higher drop test and dynamic bending test reliability than SAC105 and SAC305, and exceeded SnPb for some test...
Two novel no-flow underfill materials, NF220 for SnPb and NF260 for Pb-free, were developed and evaluated for CSP reliability enhancement applications. Results indicate these materials exhibit outstanding performance on yield and reliability, with both temperature cycling and drop test performance being one order of magnitude greater than current industry practices. In particular, those novel materials...
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