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This paper studied the influence of polyimide (PI) on the wafer warpage and electrical leakage in the wafer bumping structure and process. The wafers with different thickness PI and different PI coverage were built. And the warpage of these wafers was measured before PI coating, and after PI curing. According to the result, the thicker PI and higher PI coverage on the wafer induce larger wafer warpage...
The mismatch in thermal expansion coefficient between crystalline phase and glass phase can result in large thermal stresses during thermal processing, as well as the low thermal conductivity, which is the most troublesome in the production of the CaO-Al 2 O 3 -SiO 2 glass-ceramic. CaO content may influence the residual stress in the system. Therefore X-ray diffraction (XRD)...
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