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Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below 10um pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polymer. Later during thermo-compression bonding this polymer is cured to bond two chips together. Process flow and results of TC bonding is discussed in this...
In this paper,the wettability, quality of joint formation and electrical yield of daisy chains in 3D stacks when using Cobalt and Nickel as UBM with different finish layers such as immersion Au, ELD NiB, ELD Cu and SAM are investigated. The performance of the stacks are characterized by cross-section SEM images, EDS analysis and electrical resistance measurement of the daisy chains.
In the broad-spectrum of 3D system integration technologies, stacking of die at wafer level is considered a promising and cost effective platform solution for 3D device and 2.5D interposer assembly. The 3D die-to-wafer (D2W) approach consists of a sequence of processes: D2W stacking, wafer-level die encapsulation ("wafer reconstruction") using e.g. wafer-level molding, Wafer thinning, Through...
In this paper a bump-less process is introduced in order to further scale down the pitch of microbumps. Electrical resistance measurement, Cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.
Stacking singulated dies is an efficient way to create die stacks; IMEC uses this so-called die-to-die (D2D) stacking approach often to manufacture small to medium volumes of test chips. There is a need to perform a post-bond test on still-unpackaged (‘bare’) D2D stacks, if only to avoid unnecessary packaging costs. This paper presents an approach to perform automatic stepping and probing on arrays...
3D stacked IC (SIC) vs. 3D Interposer wafer processing and assembly challenges are discussed in this paper. We report on the key enabling technologies like wafer thinning, thin wafer handling, TSV, micro bumping, package bumping, stacking and packaging. The limited micro bump yield loss in the 3D SIC case is explained by modeling of bonding force distribution. It is also shown that for sequential...
The cost of 3D process flows is one of the most important aspects for the broader adoption of 3D integration by the semiconductor industry. In this paper the processing cost of the features and components that enable 3D stacking is considered and compared. Different stacking approaches are considered: D2W, W2W and interposer-based stacking. Furthermore, the impact of processing yield and pre-stack...
Assembling multi-layer thinned Si chips to form 3D ICs in a fast, reliable, and cost-effective manner is one of the key processes to enable wider application and commercialization of 3D integration. In this paper the essential aspects of process development for stacking multi-layer 3D ICs are investigated. Combining thermo-compression bonding (TCB) process and the usage of pre-applied wafer-level...
In this paper a reflow process for fine-pitch micro-bumps is studied. A mathematical model for the reflow process is proposed and verified by experimental measurements. The influence of reflow profile parameters on the shape of micro-bumps, will be discussed using three commercial reflow ovens. Furthermore, measurement results of bump height variations after reflow over a 300mm wafer will be presented.
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