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Low-temperature sintering bonding has been proposed as an alternative technique for the soldering to overcome such high operating temperature in wide-gap semiconductor power devices. Ag nanoparticle sintering is one of the candidates in die-attach bonding, but there are certain obstacles for mass production mainly due to the high cost of silver. In addition, metal nano-particle paste including Ag...
Pressure-less sintering of Cu flake paste is achieved assisted by hydrogen plasma process toward die-attach technique of next-generation high-temperature power semiconductor devices. The sintered paste shows high bond strength aver 50 MPa, showing large abnormal grain growth at the bonding interface, with homogeneously distributed void of porous interconnection layer. Our results indicate that still...
Copper (Cu) wire has been highlighted as a low cost material for use in thermo sonic ball bonding for various package (PKG) groups. This wire has already been applied in high-end PKGs such as BGA, QFP and QFN in mass production, and the volume is feasible. Not only the advantage of a low cost material, but Cu wire has other merits which include higher electrical conductivity and a much slower intermetallic...
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