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In nearly all soldering processes, it is the intermetallic (IMC) layer that bonds the solder to the base metal. Thus, the IMC layer is necessary for any successful soldering operation used in the electronic industry. That is, a solder joint always has at least one IMC layer. While the IMC layer is needed, it is not static. It grows in subsequent reflows and during aging with time. Its growth without...
We report a wafer-to-wafer bonding technique with solder as the bonding layer but without the use of any flux. This fluxless or flux-free feature makes void-free and uniform bonding layer possible. If flux were used as in the case of typical soldering processes, the flux or flux residues could be easily trapped in the joint, resulting in voids and uneven solder layer. Flux residues, if not completely...
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