The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Laser-driven ion acceleration is of great interest across a range of disciplines with potential applications including the fast ignition approach to inertial confinement fusion and proton therapy. The most robust acceleration mechanisms studied to date however, based on target normal sheath acceleration (TNSA), do not satisfy the emittance, flux and ion energy requirements for direct applications.
This chapter focuses on nanocrystalline diamond layers deposited on single‐crystalline silicon wafers by a hot‐filament chemical vapor deposition (CVD) process via a controlled dissociation of an appropriate gas mixture at high temperatures. It demonstrates that the physical and chemical determinants of biocompatibility, including information of the nanoscopic interfacial water layers can only reasonably...
For high temperature interconnection sintered silver can be used, however, it induces new demands on the thermo-mechanical design. That issue requires knowledge on the thermo-mechanical reliability of silver sintered devices, the subject of this paper. Material characteristics of the sinter layers are needed for simulation, which are addressed in the first part of the paper. Based on material properties...
New high temperature interconnection technologies emerge because of the need for electronics use at temperatures beyond 150 °C. Transient liquid phase (TLP) soldering is one option with the advantage of processing conditions being close to those for conventional soldering. In the Cu-Sn system addressed in the paper, a high post-processed melting point of the solder interconnects is achieved due to...
In order to match high power density and large counts of I/Os with the need for smaller-sized automotive electronic devices and low cost, new solutions have to be developed without any concessions to reliability. The authors describe the so-called i2Board concept, developed by Schweizer Electronic AG and used in the VISA project, funded by the German Government. VISA is an abbreviation and means "fully...
Developing applications and protocols for wireless sensor networks is a time consuming and error prone task, which possibly includes many iterations of implementation and testing. While simulations will probably not replace testbed experiments completely, they are a time efficient tool for rapid prototyping of sensor networks. Writing code and testing an application is often done using a different...
Having access to accurate position information is a key requirement for many wireless sensor network applications. We present the design, implementation and evaluation of SpiderBat, an ultrasound-based ranging platform designed to augment existing sensor nodes with distance and angle information. SpiderBat features independently controllable ultrasound transmitters and receivers, in all directions...
One of the most important challenges in advanced automotive electronics is to manage increasing power within smaller and smaller devices. Further important requirements are system cost reduction and high reliability. Within the VISA project (fully integrated power electronics for automotive, [1]), funded by the German government, new highly integrated packaging technologies are under investigation...
Sensor packages have often to be adapted to current customer requirements. Dimensions, interior structures, or materials may change. In general, this influences strongly the thermally induced warpage during the wafer level manufacturing process and of the separated single packages which has to be controlled with respect to reliability issues. Therefore, the package manufacturer needs for a proved...
Accurately synchronized clocks are crucial for many applications in sensor networks. Existing time synchronization algorithms provide on average good synchronization between arbitrary nodes, however, as we show in this paper, close-by nodes in a network may be synchronized poorly. We propose the gradient time synchronization protocol (GTSP) which is designed to provide accurately synchronized clocks...
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology. One way to achieve this is to bury active as well as passive components into the printed circuit boards. In addition, very short interconnects can be realised which is advantageous especially for RF applications. Besides the pure functionality, the designers of new products have to meet...
Within the framework of the project VERSA, a new approach to beam forming networks is investigated. The aim is to combine structural and electrical functions in one multilayer to gain electrical performance and to save weight. For this purpose a library of standard components for the RF-designer is developed, as well as the fabrication technology to produce these modules reliably and with high yield.
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology, driven by requirements like low cost and high reliability. One way to meet these demands is to follow the so-called ldquochip in duromerrdquo approach, which allows an extremely dense integration and very short interconnects. Already in the very first design phase of advanced products,...
More and more dense packaging is one of the most important challenges in advanced electronics and micro technology, driven by requirements like low cost and high reliability. One way to meet these demands is to follow the so-called ldquochip in duromerrdquo approach, which allows an extremely dense integration and very short interconnects. Already in the very first design phase of advanced products,...
The number of patients with primary prophylactic ICD implantation rises. Resources for a regular ICD follow- up every 3 months are not available. The REFORM Study investigated in a prospective, randomized and multicenter comparison study the effect of ICD home monitoring (HM) against conventional follow-up (FU) in MADIT II patients: A special focus was on different resource use and resulting costs...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.