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Automated identification and characterization of clustered weld defects, which comprise a plural of closely distributed individual member defects, is challenging. In this paper, time, Cartesian and Polar domain features in phased array ultrasonic sectorial scanning data are studied to segment clustered weld defect echoes by density based and K-means clustering. Through multiple domain segmentation,...
As semiconductor feature sizes continue to shrink and outstrip lithography advances, the nature of manufacturing defects has evolved from hard faults to a more subtle lithography-driven form where its impact results in marginal circuit behavior, giving rise to so-called marginal defects. Due to the increasing divergence between test and system modes of operation in complex system-on-chip (SoC) devices,...
Shrinking semiconductor feature sizes are giving rise to subtle defects that cause marginal circuit behavior rather than hard failures. As test and system modes of operation diverge in complex devices, marginal defects can escape production test but trigger end-system failures. Thus system-level testing (SLT) becomes imperative. But SLT adds extra cost and limits volume throughput. This paper describes...
Adding functionality to a passive Si interposer used in 2.5/3D integration, can result in system cost reductions. In this work, active components (diodes, BJT, …) have been integrated on Si interposer using a new low-mask process flow. This low-cost process enables: (1) to move part of the area hungry ESD protection from the stacked dies to the interposer; (2) the realization of pre-bond testable...
Adding functionality to a passive Si interposer used in 2.5/3D integration, can result in system cost reductions. In this work, active components (diodes, BJT, …) have been integrated on Si interposer using a new low-mask process flow. This low-cost process enables: (1) to move part of the area hungry ESD protection from the stacked dies to the interposer; (2) the realization of pre-bond testable...
In this paper we describe a novel scheme for collecting and analyzing a chip's failure signature. Incorrect outputs of digital chips are forced by applying scan patterns under non-destructive stress conditions. From binary mismatch responses collected in continue-on-fail mode, numeric data features are formed by grouping and counting mismatches in each group, thus defining a chip's “analog” failure...
A new computational scheme for visual attention modeling is proposed. It adopts both low-level and high-level features to predict visual attention from a video signal and fuses the features by using machine learning. We show that such a scheme is more robust than those using purely single level features. Unlike conventional techniques, our scheme is able to avoid perceptual mismatch between the estimated...
We present a novel thermal conductivity detector design in which output is minimally affected by changing flow rates in a microchannel. In gas chromatography systems, pressure fluctuations can result in false peaks and an unstable baseline, reducing the systems limit of detection. Furthermore, ramping the temperature of a separation column, used in many chemical separations, changes the viscosity...
For the past fifty years, small businesses founded by entrepreneurs have been not only the base of the economy of Taiwan, but also the main vigor of the economy. Among the start-up business activities, seeking opportunities and shaping corporate entrepreneurship are important factors affecting the success of the start-up. This study proposes that entrepreneurs should design proper organizational culture...
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