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The primary objective of this work was to characterize the current carrying capability of Sn0.7Cu solder bumps for use in high power flip chip module applications. The factors to be considered in using modules as test vehicles for current carrying capability studies are explored. Experimental data on the current carrying capability of Sn0.7Cu solder bumps in a module test vehicle is complemented with...
A series of electromigration tests were performed as a function of temperature and current density to investigate lifetime statistics for Pb-free solder with Cu or Ni under-bump-metallization (UBM). Based on the overall shape of resistance traces, a conservative failure criterion for time-to-failure was defined and the results were compared with those based on the conventional open-failure criterion...
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