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A hierarchically structured Cu-Ni-P film fabricated via one-step route of electroless plating is reported. The morphology of deposits can be controlled by adjusting the additive in electrolyte. Due to the synergistic crystalline modification of polyethylene glycol (PEG), Janus Green B (JGB) and Cl−, the as-prepared Cu-Ni-P film exhibits pine-like architecture, about 2 µm in height and 1.5µm in root...
Package warpage is often a problem in surface mount reflow process especially for thin package. Large warpage prevents package solder balls to be connected to PCB pads and results in low process yield. In order to effectively minimize warpage in reflow process, this paper proposed a new approach to reduce package warpage by temporally bonding the back of the packaged component to a rigid plate. In...
A novel low-temperature solid-state bonding method that Cu microcones coated with Ag and Ag buffer has been proposed. Thin Ag layer was used to prevent the oxidation of Cu microcones and Ag layer of several micrometers was used as a buffer layer between Cu microcones and Cu bumps. No brittle IMCs formed in the interfaces.
Electronics with higher Input/Output (I/O) density and smaller package size challenge the fine pitch flip chip technology. Thermal compression bonding combined with pre-applied non-conductive film (TC-NCF) has the advantages of simplifying the process steps, protecting interconnects in situ, avoiding the flux residue and having no concerns of adhesive overflow issue. It is a promising process for...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
As the major unit of the electrical energy transformations device, IGBT (Insulated Gate Bipolar Transistor) determines the lifetime of the power device immediately. IGBT module is normally made up of chip, DBC (Direct Bonded Copper), substrate and bonding wire, Due to the different CTE(Coefficient of Thermal Expansion), thermal stress occurs when IGBT module works. which leads to device failure. In...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
A simple electroless deposition method of fabricating silver nanosheets which is a promising replacement for a high-temperature lead-rich solder used for electronics has been reported. This substrate free deposition method can solve the surface coating problem of the nanostructured silver. By controlling the deposition time, the silver nanosheets with a length of 2μm and a width ranging from 10nm...
0.1 μm soft gold film substrate was ultrasonic bonded with 0.6 mil gold wire, which effectively reduced gold assumption comparing to the traditional 0.3∼0.5 μm soft gold film substrate. The substrate showed good bondability by wire pull test (WPT) and perfect reliability by high temperature storage test (HTST). The bonding structure in failure mode of wire pull test was studied by focused ion beam...
As the major unit of the electrical energy transformations device, IGBT (Insulated Gate Bipolar Transistor) determines the lifetime of the power device immediately. IGBT module is normally made up of chip, DBC (Direct Bonded Copper), substrate and bonding wire, Due to the different CTE(Coefficient of Thermal Expansion), thermal stress occurs when IGBT module works. which leads to device failure. In...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
Ag-8Au-3Pd alloy wire has great potential of low-cost candidate for traditional gold wire interconnects. This study aims to light the behavior of degradation that took place in Ag-8Au-3Pd alloy wire bond interface. Two layers of intermetallic compound (IMC) at the Ag-8Au-3Pd/Al bond interface were observed by transmission electron microscopy (TEM). The specimens were annealed at 175°C in a closed...
In recent years, silver alloy wire has been widely used in semiconductor industry. In contrast to conventional gold wire, silver alloy wire has better electrical property, thermal conductivity and lower cost while tends to migrate more easily under high temperature and current density. In this paper, electro-migration (EM) of silver alloy wire after wire bonding has been studied. Under accelerated...
Ni/Au microcones were fabricated and thermosonic bonded with Au wire. The thickness of Au film was only 0.05μm. The substrate with Ni/Au microcones showed good Au wire bondability with the average pull strength 4.85 gf and ball shear strength 54.33 gf. Microscopi observation showed that Ni/Au microcones were inserted into Au wire, thus physical interlock between the substrate and Au wire was formed...
Ag-8Au-3Pd alloy wire has shown its advantages as a kind of interconnect material in semiconductor packaging. In thermosonic wire bonding, a uniformed and stable Free-Air-Ball (FAB) created by electronic flame-off (EFO) is crucial to a reliable 1st bond. In this study, the relationship between Free-Air-Ball (FAB) size and EFO parameters (EFO current, EFO time) of 0.6 mil Ag-8Au-3Pd alloy wire has...
Study of diffusion mechanism in low-temperature bonding method based on Cu microcones is reported. A Sn layer was electrodeposited on the Cu microcones and the electrodeposited Cu substrate then annealing at bonding temperature 463 K. IMC grains of Sn/Cu-microcones diffusion samples grew slow with smaller size. The special morphology of Cu microcones was beneficial for the growth of intermetallic...
In this paper, the copper property under various ultrasonic powers was firstly investigated by experiment. It is found the ultrasound has an acoustic softening effect on copper free air balls (FABs). The stressstrain behavior of copper FABs that accounted for acoustic softening effect was achieved by combining experiment and numerical simulation. Then a non-linear finite element (FE) model was built...
Temperature/ Humidity (T/H) stress experiments were designed to reproduce the pad corrosion defect and study the relationship between pad surface fluorine concentration and the formation of pad corrosion defects for different IC fabrication technologies. Results showed that T/H = 40/80 (i.e., at 40°C & 80% relative humidity, RH) was the condition with the most pad corrosion defects. The pad surface...
In this paper, the effect of Ni-W alloy barrier layer on copper pillar/Sn IMCs evolution has been investigated. Additive W weight content of Ni-W alloy ranged from 16 to 18 at. %. Controlled thickness of barrier layer was prepared on Cu substrate. Then, excessive matte Sn electroplated on as-deposited Ni-W layer. Ni-W had compact microstructure in state of FCC solid solution, which means it had good...
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