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A hierarchically structured Cu-Ni-P film fabricated via one-step route of electroless plating is reported. The morphology of deposits can be controlled by adjusting the additive in electrolyte. Due to the synergistic crystalline modification of polyethylene glycol (PEG), Janus Green B (JGB) and Cl−, the as-prepared Cu-Ni-P film exhibits pine-like architecture, about 2 µm in height and 1.5µm in root...
EphA2 is activated through phosphorylation on serine 897 (S897) by Akt to promote cancer cell motility and invasion, independently of stimulation by ephrin, its ligand. Here we show that S897 phosphorylation of EphA2 strengthens the interaction between EphA2 and Ephexin4, a guanine nucleotide exchange factor for the small GTPase RhoG. S897A mutation of EphA2 abolished the EphA2/Ephexin4-mediated RhoG...
A low-temperature InP/Si integration method using Au-Au surface-activated bonding (SAB) at a temperature of 150 °C was demonstrated for hermetic chip size packaging. Au sealing rings (thickness: 500 nm, width: 100 μm) and Au thin film (thickness: 300 nm) were used as bonding layers for SAB at atmospheric pressure. Fracture images after die shear test showed the interface area was well bonded and the...
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