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In this paper, the technology of through silicon via (TSV) is applied to radio frequency (RF) receiver module. A grounded coplanar waveguide (GCPW) with TSV is proposed, through the simulation, and the improvement of TSV on RF transmission performance is studied, including TSV's aperture size, density, arrangement and so on. This paper also studies basic components model such as resistance, capacitance...
In this paper a highly integrated MCP concept apply to MMICs from DC up to Ku-band is presented. This type of package of low-temperature co-fired ceramic system-in-package (LTCC-SIP) with ball grid array (BGA) structures hereby can realize miniaturization, low-weight and multifunction. More than one of the multi-function MMICs are wire-bonding or flip-chip mount on the top of multilayer LTCC substrate...
In this paper a highly integrated MCP concept apply to MMICs from DC up to Ku-band is presented. This type of package of low-temperature co-fired ceramic system-in-package (LTCC-SIP) with ball grid array (BGA) structures hereby can realize miniaturization, low-weight and multifunction. More than one of the multi-function MMICs are wire-bonding or flip-chip mount on the top of multilayer LTCC substrate...
The bulk titanium deep reactive ion etching (DRIE) enabled high aspect ratio structures and devices are promising for harsh and in vivo environments applications. An etching model is necessary for better profile control to acquire needed performance, in which a correct ion angular distribution (IAD) in chlorine plasma is crucial. In this paper, an overhang SU-8 structure is proposed to experimentally...
In this study, substrates with a large topography were aligned and bonded, and a spray-coated SU-8 was employed as the adhesive layer between two complementary non-planar surfaces. Both wafer-level and chip-level bonding were carried out with an alignment tolerance of 5 μm. The bonding pairs exhibited enhanced tensile strength and shearing strength compared to that of the planar surface bonding, which...
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