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In this work we investigate the correlation between hydrogen content and leakage current through the Al2O3 layers of TANOS memories. We put in evidence that retention of TANOS memories is improved with the decrease of H concentration in the Al2O3 layer. Using atomistic simulations consolidated by detailed Al2O3 physico-chemical analyses, we find that interstitial H produces a midgap trap likely to...
In this work, we show that a detailed atomistic model of SiN defects provides a consistent explanation of the program/erase/retention characteristics of both NROM and MANOS charge-trap cells. Our analysis of devices with SiN layers of different stoichiometry is also consistent with original KFM measurements of trapped charge drift in SiN layers.
Three different nitride-based trapping layers have been investigated: a standard silicon nitride, a Silicon-rich and an Oxygen-rich silicon nitride deposited by Low Pressure Chemical Vapor Deposition (LPCVD). First the physical properties of the films are studied. A gap of 5.3 eV and a refractive index of 2.07 were found for the standard Silicon Nitride using spectroscopic ellipsometry. Excess silicon...
In this work we present the integration of Band Engineered TANOS-like memories using HfSiON in the tunnel stack to boost the programming efficiency and improve cycling. An accurate correlation analysis between the gate-stack material physical properties and the memory performances is presented. In particular, the importance of the nitridation step of HfSiON on the memory retention characteristics...
In this paper, we have studied the charge trapping mechanisms of nitride-based non-volatile memories. The impact of different silicon-nitride (SiN) compositions (standard, std, and Si-rich) on the device characteristics has been investigated through material characterizations, electrical measurements, atomistic and electrical simulations. We found that the different physical nature of the dominant...
The integration of silicon nanocrystal (Si-nc) nonvolatile memory (NVM) arrays with HfAlOx based interpoly dielectric (IPD) is presented for the first time. The data obtained on array vehicles programmed in Fowler-Nordheim operation regime are in excellent agreement with previously presented results on single cells, as well as theoretical data and allow the evaluation of the scalability of the Si-nc...
In this paper, different Hf-based oxides (HfO2, HfSiO under several annealing conditions, HfSiON, HfAlO with various compositions) are simultaneously considered as storage layers of charge-trap memories. Based on material characterization analyses, electrical data of memory cells, physical modeling of charge-trap devices, we show that a strict relationship exists between the crystal structure of the...
Replacing the tunnel oxide of non-volatile memories by a high-k dielectric is addressed in this paper. This work reports in its first part an experimental study of conduction and trapping in Al2O 3 layers. The experimental data of these layers is then integrated in a novel endurance model suitable for flash memories with high-k tunnel oxide. Simulation results show that low (+8/-7V) operating voltages...
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