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This work presents an overview on the role of the stress state and stress Triaxiality Factor (TF, see Eq. (1)) in lifetime prediction of solder connections. According to various literature sources, the TF is one of the most important factors influencing initiation of ductile fracture (Bao and Wierzbicki, 2004; Davis and Connelly, 1959). It is widely reported that lifetime of the ductile materials...
This paper is focused on the thermally-induced thermo-mechanical load in interconnections of electronic products, which are necessary to connect an electronic component on substrate material (such as Printed Circuit Board). In order to improve of the material selection, the Fraunhofer IKTS has developed a measurement setup enabling a cost-efficient material characterization in terms of mechanical...
In the past, a large number of material models for Sn-based solder alloys have been proposed, which are usually calibrated based on the material testing under isothermal the conditions. However, their ability to map the lifetime differences depending on the temperature rate under the field and test-lab conditions, as well as on the mean operating temperature, is still not completely investigated and...
This work presents an overview on the role of the stress state and stress Triaxiality Factor (TF, see Eq.1) in lifetime prediction of solder connections. According to various literature sources, the TF is one of the most important factors influencing initiation of ductile fracture [5, 16]. It is widely reported that lifetime of the ductile materials decreases under hydrostatic tension when combined...
Two Plastic Ball Grid Array (PBGA) designs were stressed with Temperature Cycles (TC) in the Board Level Reliability (BLR) test, and simulated using FEM. The test result for one of the PBGAs was not in line with original expectation, but it was confirmed by FE-simulation. The simulation incorporated manufacturing process (the real post-cure shape verified by measurement) and viscoelastic material...
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (electronic control unit) depends on the thermal expansion mismatch between the materials of the device and the PCB (printed circuit board), so called local mismatch, as well as on the global deformation of the PCB induced...
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