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In this paper a high order temperature compensation current reference circuit was proposed, which is accomplished by two current source with opposite temperature coefficients (TC) to obtain a smaller TC. The proposed circuit with a simple structure designed in Global Foundries 0.18μm CMOS process, achieving a temperature coefficient of 30.7ppm/°C in the range of −50∼120°C, and the quiescent current...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
It is well known that temperature variation affects a MEMS device's performance. In this paper, the effect of temperature on the whole MEMS based gyroscope is observed by recording and analysis the zero rate output (ZRO). The effect of temperature on the ZRO comes from material parameter changing and electronic parameter changing. With temperature changing, the ZRO of the gyroscope suffers from changes...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
Quadrate Flat Package (QFP) is chosen as package mode of chip for typical Hall-effect current sensors. In this paper, taking the deformation behavior of QFD structure under the temperature loading into consideration, according to related physics laws such as Fourier heat transfer law, Stephen-Boltzmann law and Newton's law of cooling, the thermal simulation of packaging for current sensor is implemented...
The thermal conductivity of finite-length singlewalled carbon nanotubes (SWCNTs) was investigated using non-equilibrium molecular dynamics (NEMD) simulations. The temperature and diameter dependence of thermal conductivity was studied in this paper. In this work, thermal conductivity of SWCNTs with the length of 24.5nm and different diameter — (6, 6), (7, 7), (8, 8), (10, 10), (15, 15) was studied...
Previous researchers usually set a constant heat transfer coefficient (HTC) for the surface heat exchange according to experience or empirical formulas to investigate the distribution of temperature and stress in their thermo-mechanical analysis, but this method does not satisfy the real condition since HTC may not be the same as people assume especially when the size is very small. Moreover, HTC...
Thermal contact resistance is an important parameter for the thermal management of electronics packaging. A type of test instrument for measuring thermal contact resistance was presented in this paper. Thermal contact resistance across a brass-brass (Cu-Cu) interface was investigated by the present instrument. The results show that the contact thermal resistance is at the magnitude of 10-4 for the...
As the power density enhances while package size decreases, thermal management becomes a primary concern of the reliability and performance of the electronic packaging. When the natural convective heat transfer can't meet the thermal budget, a forced convective heat transfer must be employed in order to prevent the inappropriate temperature and thermal induced stress which would cause many problems...
A finite element model which includes electromigration, thermomigration, stress migration and concentration diffusion is established to study the mass diffusion phenomenon. Numerical experiment is carried out to obtain the electrical, thermal, stress and atomic concentration fields of the sweat and through silicon via (TSV) structure under high current density load. The effectiveness of the electromigration...
Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge...
A nonlinear transient heat transfer finite element model based on commercial finite element software, ABAQUS, is developed to simulate the curing process of silicone adhesive. The curing reaction process and specific heat of the silicone adhesive were investigated using a differential scanning calorimetry (DSC) to obtain material parameters for numerical simulations. Curing reaction kinetics was derived...
Multiple-chip packaging becomes common in LEDs packaging community. For such types of packaging, thermal spreading resistance is an important factor to impact the total thermal performance of LEDs. In this paper, a general analytical solution based on the method of variable separation for thermal spreading resistances of eccentric heat sources on a rectangular flux channel is used to calculate the...
Selective induction heating for wafer level bonding is presented. The purpose of this paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area...
In this paper, a non-linear and one-directional coupled finite element framework has been implemented to simulate induction heating process of wafer-level packaging. Based on numerical results of induction heating, thermally-caused warpages and stresses of the single-sided ceramic wafer have been evaluated. Some primary experiments have also been conducted to verify the numerical method. Using three-dimensional...
In order to enhance measurement accuracy, a gas mass flow sensor integrated with micro channels is proposed in this paper. The uniqueness of this flow sensor is that there is thermal convection effect on two sides of diaphragm, which results in a more sensitive temperature distribution. The temperature characteristics of the novel flow sensor are simulated at different flow rates, and the optimization...
As high power LEDs develop rapidly, sapphire substrate on which LED's chips are grown, cannot meet the needs of the increasing performance any longer. Therefore, transfer of the devices from the former sapphire substrates to more thermally and electrically conductive receptor substrates is recommended. Laser peeling has been a new technology of separating films of GaN from the substrate on which they...
System-in-package (SiP) provides an approach of multi-chip module (MCM), which encapsulates two or more chips in one system in order to realize smaller and lighter packaging size. A typical model SiP made of three-layer chips is studied in the paper. The model system is modified by attaching copper layers which take the advantage of its thermal dissipation and then finite element analyses are conducted...
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