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During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package, a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed. The principle and customized equipment of this method were introduced. Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment. The main...
Due to the extreme complexity of neuroscience and neurosurgery, there is naturally a need for probing systems with more functions which can probe in three dimensions. For instance, nerves can size differently in different locations and can present three dimensional neuro imaging with multiple recording and stimulating points, calling for the new developments in this emerging field. It is also highly...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package, a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed. The principle and customized equipment of this method were introduced. Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment. The main...
An equivalent circuit model for low pitch-to-diameter ratio (P/D) through silicon via (TSV) in three-dimensional integrated circuit (3-D IC) is proposed in this paper. The shunt admittance of this model is calculated based on the method of moments which can accurately capture the proximity effect for both a TSV pair and TSV array. The metal-oxide-semiconductor (MOS) capacitance of TSV is also considered...
Development and application of LED in situ measurement and binning system are proposed and demonstrated. In this system, the photometric and colorimetric properties of LED can be measured in a matter of milliseconds, and the measured LED can be binned to a specific bin based on color, intensity, and forward voltage. An algorithm is designed to deal with the determination of dominant wavelength of...
The highlight model can be expressed by transfer function when the echoes obey the linear acoustic law. This paper aims to present a new beam forming method based on highlight model via the combination of transfer function of highlight model and beam forming technology. Information such as the azimuth of target can be obtained by beam forming using a few highlight. And this paper simulates the beam...
In this paper, a new joint direction of departure (DOD) and direction of arrival (DOA) estimation method is presented for bistatic multiple input multiple output (MIMO) radar. Because all the diagonal elements of the transmitting and receiving invariance matrices are located on the unit circle of the complex plane, we construct a complex matrix so that the DOD and DOA pairing is given automatically...
Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge...
By constructing a novel symmetric subarrays structure, a new 3-D near-field source localization algorithm is proposed. The new method can be divided into three important parts. The first part is the elevation angle estimation based on two generalized ESPRIT algorithm by a vertical uniform linear array, which are spectral search-based generalized ESPRIT and search-free generalized ESPRIT. And the second...
The problem of estimating the directions of arrival (DOAs) of perfectly correlated signals in the near-field (the Fresnel region of the array aperture) is considered. A new estimation algorithm which combines the ideas of spatial smoothing and array interpolation in the near-field is derived. The proposed technique can be applied to uniform linear array geometries in the near-field when the ranges...
Selective induction heating for wafer level bonding is presented. The purpose of this paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area...
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