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The microelectronics industry has progressed astonishingly along several decades, thanks to the MOS transistor shrinkage. However, the parasitic gate capacitance becomes an important concern for device behavior optimization in the nanometric range. The fringing parasitic gate capacitance exhibits weaker channel length dependence than the intrinsic counterpart. For this reason, the relative weight...
These last years, the triple‐gate fin field‐effect transistor (FinFET) has appeared as attractive candidate to pursue the complementary metal‐oxide semiconductor technology roadmap for digital and analog applications. However, the development of analog applications requires models that properly describe the static and RF behaviors as well as the extrinsic parameters related to the three‐dimensional...
A methodology to properly establish an accurate SOI FinFET compact model through SPICE simulator is presented. This compact model is implemented in Verilog-A to simulate the performance of RF circuits based on SOI FinFET technology. It predicts well static behavior of the transistor and circuit, as well as their small-signal RF behavior by modeling the intrinsic capacitances and also the effects of...
In this paper, a semi-analytical extrinsic gate capacitance model for Triple Gate FinFET, based on three-dimensional numerical simulations, is presented. The model takes into account the source/drain electrode and contact areas. It includes 5 capacitance components that describe the different fringing electrical couplings that exist inside the FinFET structure. The semi-analytical model accurately...
In this paper, we develop an analytical model to simulate strained silicon NMOSFETs, which allows to describe the drain current. Numerical simulations were performed in order to validate the model, where different technological parameters were considered (e.g. impurity concentrations in Si1−yGey and strained-silicon films). A good agreement with numerical simulations has been obtained.
Triple-Gate FinFETs have been demonstrated to be promising to push further the down scaling of the CMOS technology, thanks to their high immunity against the so-called short channel effects. However, due to their three-dimensional (3-D) architecture, strong degradation of their analog characteristics has been reported, basically due to large extrinsic resistances and capacitances. In this paper, based...
A new extraction method of the intrinsic parameters of the small-signal equivalent circuit model of SOI MOS transistors (MOSFET) is presented. This new method does not need the previous knowledge of the extrinsic series resistances, moreover, it is possible to directly determine the intrinsic parameters at the bias point of interest. Floating-Body SOI MOSFETs are analyzed using this method.
An electronically-reconfigurable spiraphase-type element based on a ring slot resonator is analysed. It is demonstrated with numerical simulation and experimental measurements that optimal transformation of the switch impedances is possible in this element. As a result, low loss of 0.38 dB is obtained for the one-bit element at the frequency of 11.55 GHz.
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