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A reconfigurable heterogeneous 3D-IC is assembled from two 28 nm FPGA die with 580 k logic cells and two 65 nm mixed signal die on a 65 nm interposer in a 35 mm 2 CS-BGA package. One mixed signal die consists of sixteen 16 bit current steering DACs, the other die consists of sixteen 13 bit pipelined ADCs. The interposer provides optimal system partitioning; noise isolation and high density interconnect...
Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system...
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