The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A “scalable 3D-FPGA” using TSV interconnects is proposed. This FPGA was designed on the basis of homogeneous 3D-stacking to extend the logic scale in proportion to the number of stacked layers. To improve Z-axis transmission performance, a wafer-to-wafer stacking process for lowering the capacitance of TSV was developed. An “embedded TSV“ design for the shorter on-chip wirings was also devised. Moreover,...
A “scalable 3D-FPGA” using TSV interconnects is proposed. This FPGA was designed on the basis of homogeneous 3D-stacking to extend the logic scale in proportion to the number of stacked layers. To improve Z-axis transmission performance, a wafer-to-wafer stacking process for lowering the capacitance of TSV was developed. An “embedded TSV“ design for the shorter on-chip wirings was also devised. Moreover,...
We propose a novel method of information technology (IT) control that makes highly effective use of batteries under conditions where IT systems are powered by batteries during power outages. The main feature of this method is that it both utilizes battery residue and the forecast duration of power outages taking battery characteristics into consideration. We made a prototype using actual batteries...
3-dimensional (3D) integration is imperative for the future of semiconductor devices. The 3D field-programmable gate array (FPGA) is one of the killer applications in this field because large-scale FPGA requires numerous wire segments that conventional 2D integration cannot deal with. We have developed a true-3D computer-aided design (CAD) tool for the 3D FPGA and have quantitatively compared its...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.