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The wafer-level package (WLP) was popularized to develop for mobile phones, tablets, portable players, wearable and IOT devices to fit small form factor and low profile benefits. Currently, WLP was demanded to increase I/O density and performance into applications with higher levels of integration. In order to develop the need for an evolution in functionality of WLP technology, WLP would suffer potential...
Coreless substrate was popularized to develop for Enhanced Package on Package (ePoP) series package to effectively shrink package thickness and provide higher electrical performance. Therefore, in order to achieve those targets, Embedded Trace Substrate (ETS) coreless substrate was approached on bottom FCCSP package of ePoP structure. However, the warpage performance is the critical challenge for...
In recent years, low cost solution was demanded to develop for Chip scale package series package to achieve the same performance or better than original. Regarding this requirement, the low cost substrate (coreless substrate) was developed to replace traditional substrate to achieve this target easily such as Molded Interconnection System BGA (MISBGA), Embedded Trace Substrate (ETS) and Single Layer...
In recent years, Cu pillar bump technology was proposed intensely in place of solder bump to achieve more I/Os signals, better electrical characteristics and cheaper price requirements by enlarging substrate circuit layout density, reducing substrate layers and narrowing package sizes. Cu pillar bump may suffer potential Extreme low-k (ELK) crack or delamination due to Cu post has higher modulus compared...
By employing the physical characteristics of creep deformation mechanisms for solder joints in a flip-chip ball grid array (FCBGA) package under a thermal cyclic condition, an analytical model for the prediction of mean-time-to-crack (MTTC) is presented in the paper. With the consideration of time-dependent thermal testing functionals, the basic co-analyses of one-cycle Nabarro-Herring and Coble creep...
With the quick development of electronic products, IC chip with more functionalities, higher performance, miniaturization, higher reliability and lower cost have been requested intensely, especially in portable device domain such as cell phone, camera, notebook. Based on that, the electrical product using CSP series such as WLCSP, TFBGA, QFN etc. need further evaluation to meet those requirements.
In recent years, electronic product have been demanded more functionalities, miniaturization, higher performance, reliability and low cost. Therefore, IC chip is required to deliver more signal I/O and better electrical characteristics under the same package footprint. None-Lead Bump Array (NBA) Chip Scale Structure is then developed to meet those requirements offering better electrical performance,...
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