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New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The socalled system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed. Transient thermal methods provide techniques...
The thermal performance of semiconductor devices is most often specified according to JEDEC standards JESD51 1–14 which describe precisely how various steady-state thermal metrics are to be measured. Most of these metrics represent a thermal resistance between the junction of a semiconductor and some reference; e.g. Rth-JA (Junction-to-ambient), Rth-JB (Junction-to-board), or Rth-JC (Junction-to-case)...
Most of the electrical components (transistors, resistors, etc.) are thermally sensitive elements. Thermal coupling between elements of integrated circuits is a well-known parasitic effect, which must be taken into account in the design process.
In order to estimate exact thermal resistance of light-emitting diodes (LED), we introduced a new concept of effective internal optical power (IOP) of LED packages. It is because all photons generated at active region of LED chip cannot emit outside due to the difference of refractive index between a LED chip and an encapsulant material. The meaning of the effective IOP of LED package is non-thermal...
Thermal analysis is essential in 3D-IC technology due to the reduced footprint and higher power densities compared to conventional 2D packaging [1]. Compact thermal models (CTM) are being developed for fast evaluation of the thermal distribution in the 3D packages. The CTM discussed in this paper is based on the Green's function theory and exploits convolution and fast Fourier transform to compute...
The paper presents a new, nondestructive method of determination of the air-tightness of metal packagings of transistors. This method is based on the thermoacoustic approach with a microphone detection. Thermoacoustic approach means that the sound is generated by the periodical temperature of the element caused by the periodical electric power dissipation in it. In the paper both the experimental...
The advances in electronic packaging made it possible to encapsulate several independent semiconductor dice into a single package. In the last decade many packaging configurations are realized which range from the multichip modules to the 3D stack-die structures. Thermal aware design of such structures become complex, though. To understand the thermal behavior of multichip structure containing multiple...
This paper studies the typical solar cell applications of spin-on silicate glass layers (Filmtronics Inc. 15A and 20B) in function of the applied heat treatment. The masking capability in wet etching procedures, like surface texturing and long-time anisotropic etching used in semitransparent solar cells, and also the surface passivation characteristics of p-type surfaces were examined. Optical microscopy...
In this paper, we present a new approach of controlling the growth density of carbon nanotubes (CNTs) by controlling the thickness of Cu underlayer. Tested thicknesses of Cu range from 5nm to 150nm. In this work, we have tried two kinds of barrier layer material, namely Mo and Al2O3 against the diffusion of Ni catalysts. The results suggest Al2O3 is a better barrier layer material and more suitable...
This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field...
We propose an innovative thermal modeling approach that takes into account different “levels-of-knowledge” as they become available during the design phases of microelectronic systems. There are many tools available for thermal simulations which are well-suited for high-precision modeling. However, their applicability severely diminishes if CAD models are not available or modeling time is limited...
The measurement of the power dissipated by a semiconductor device is of great importance for assessing system performance and reliability and to evaluate the overall efficiency of a power electronics systems. Efficiency measurement can be difficult when the device is highly efficient and the power losses are extremely low. Measurement errors can be introduced due to high frequency components in the...
In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. For large systems, the associated thermal architecture is becoming more and more complex and costly. In most electronic assembly, thermal interface materials (TIM) help provide a path for the heat to be transferred from the hot source to a cooler heat...
In this paper, we investigate the co-design of multicore architectures and microfluidic cooling for 3D stacked ICs. The architecture is a 16 core, x86 multicore die stacked with a second die hosting an L2 SRAM cache. First, a multicore x86 compatible cycle-level microarchitecture simulator was constructed and integrated with physical power models. The simulator executes benchmark programs to create...
In battery packs it is important to know, which temperature the cells have, to avoid overloads and damages. A temperature sensor, which is joined on the battery cell, delivers such data. To guarantee exact temperature measurements on the cell, reliable Thermal Interface Materials (TIM) are needed. They ensure heat transfer from battery cell to the sensor and need to provide good thermal conductivity,...
Power and thermal are major constraints for delivering compute performance in high-end CPU and are expected to be so in the future. For high end processors, junction temperature has been considered the toughest physical constraint that needs to be tightly managed. Recent trends in form-factors and the increased focus on thin and light systems such as Ultra Book, tablet computers and smartphones, shift...
Electro-thermal effects — both at the micro level of interconnects and devices and at the macro level of circuits and systems — is one of the critical issues for the future development of microprocessors, integrated networks, and other highly integrated circuits and systems. Simulation-based solutions for both design and validation have an important role to play. This paper investigates a new, highly-accurate...
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