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This research focuses on the structural analysis of aircraft electrical harnesses for the 270 VDC network. A combined experimental and simulation-based approach is used, where numerical models for the harnesses are developed and experimental data are acquired for basic test cases (steady load, pendulum test, etc.) as well as for different vibration load cases. Validation of the numerical models is...
The steady state method is a commonly used and in principle simple way to measure thermal resistance and conductivity of thermal interface materials (TIMs). The sample must be positioned between a hot and a cold plate with constant temperatures, whereby a heat flow through the sample and temperature gradient across the sample are generated. To determine the thermal resistance of the sample the heat...
The steady state method is a commonly used and in principle simple way to measure thermal resistance and conductivity of thermal interface materials (TIMs). A heat flow through the TIM has to be generated and the temperature gradient across the TIM has to be measured. This is also defined by the ASTM standard ASTM D5470 [4]. To generate the heat flow the TIM must be positioned between a hot and a...
A parametric transient thermo-electrical coupled PSPICE macro model for a power cable as well as the verification results of the experimental and finite element simulation will be introduced. The paper describes the modeling and simulation of a simplified, single-core cable parametric model, for the use in a circuit simulator e.g. PSPICE. The verification of the simulation data between ANSYS and PSPICE...
Commonly computational methods are used to determine and enhance the lifetime of electronics and electronic systems. The validity of such methods highly depends on the used material data and therefore on the quality of the accompanying experiments. For this reason different methods were combined to better determine the thermal state of a desired device of variable size, while providing this data within...
This paper introduces a miniaturized frictionless fan concept, which is similar to a piezo-electric driven fan principle and that can fits into a size of a matchbox. This type of fan has been employed for the enhancement of heat transfer by increasing the fluid circulation in regions which are otherwise stagnant. The introduced fan is based on a flexible blade whose vibration is driven by means of...
Designers of electronic packages and electronic circuits require thermal optimization for electrical and thermal plated through holes (PTH) respectively to obtain a reliability estimate. Reliability depends on PTH-geometry and manufacturing process conditions which influence thermo-mechanical properties of the board (viscous-elasticity) and electroplated copper (e.g. yield stress). This information's,...
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