The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Lithium sulfate quenched from the high-temperature melt using conventional quenching as well as rapid quenching techniques has been investigated using X-ray diffraction, scanning electron microscope, differential scanning calorimetry (DSC), vibrational spectroscopy techniques, and electrical conductivity measurements. Crystal structure of the quenched samples studied using X-ray diffraction shows...
The advancement of package technology to enable die to die interconnects have allowed Integrated Circuit (IC) technology to progress into much higher density region. The fabrication process requires wafers to be processed at lower thicknesses while bonded to a carrier. The forces applied to the thin wafer often generate localized stress fields that cause Si defects to propagate in a form of cracks...
Two series of Hydrophobically Modified Polyacrylamides (HMPAMs) were prepared by free radical copolymerization of trimethylsilylacrylamide with 3-pentadecylcyclohexylacrylamide (PDCAM) or dodecylacrylamide (DDAM) followed by removal of trimethylsilyl protecting groups. The solution properties of HMPAMs were studied in dilute aqueous solution by fluorescence spectroscopy, NMR and viscometry. The properties...
This paper studies the nanomechanical properties, including hardness and Young's modulus (both in a dry condition and in deionized water), fracture toughness, cohesive strength and scratch resistance of eight commonly used SiO2-based dielectric films, Boron Phosphosilicate Glass (BPSG), BPSG with Rapid Thermal Processing (RTP), Phosphosilicate Glass (PSG), Spin-On Dielectric (SOD), Plasma Enhanced...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.