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A post-processing module for converting monolithic silicon electronics into a large area system is presented. The concept is based on the previously demonstrated capability of a mesh-patterned, free-standing copper interconnects to be plastically stretched [1]. When such stretchable mesh interconnect is added to a functional silicon wafer, closely spaced array of IC dies can be expanded into a large-area...
A process development for stretchable silicon electronics encapsulated in a layer of polydimethylsiloxane is presented. Stretchability is achieved by segmenting the normally rigid silicon substrate into small islands (<2??2 mm2) and connecting these by flexible metal interconnects. The metal interconnects have a mesh shape providing stretchability and improved reliability. The mesh-shaped interconnects...
The feasibility of transforming completed CMOS/MEMS circuitry and designs from their rigid form realized in a silicon chip into a stretchable system is investigated by fabricating matrix arrays of silicon segments mechanically interconnected with deformable beams. High aspect ratio silicon beams are used both as molds and scaffolds for fabricating structures of Parylene and silicon-Parylene beams...
Cavity sealing based on ultrasonic or thermo-compression gold-to-gold bonding of rather narrow, 5 to 20 μm wide frames on die-to-wafer level is investigated. The seal quality is tested with an aggressive alkaline etch solution (33% KOH, at 90°C) using an aluminum test layer, which in the case of poor sealing, is readily attacked. Sealing of large cavities (~3×9 mm2) with sealing ring widths of 10...
In this paper, development and characterization of a freestanding electroplated copper interconnect for applications in flexible and stretchable electronics is presented. The copper layer with typical thickness of 5 mum is plated into a photoresist mould realizing meander and mesh-like patterns. These are subsequently released resulting in a free-standing electrical interconnect that is optionally...
In this contribution, our progress in development of deformable single-crystalline-silicon electronics by modification of the previously reported ultra-thin and flexible CIRCONFLEX technology is presented. Additional deformability/reliability is achieved by lateral segmentation of silicon/dielectric layers and connecting these using flexible electrical interconnect. In the current study, segment thickness...
The acceptable flexibility and stretchability for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide/silica rubber and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results...
The acceptable flexibility for ultra-thin substrate would be reached by embedding the ultra-thin substrate into the flexible polyimide and patterning the poly-silicon or silicon into square/hexagon segmentations. The segments interconnect by metal wires for the signal communication, different wire shapes are designed to reach more flexible. In this contribution, results of FE optimization on mechanical...
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