The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper discloses the design optimization of embedded electromagnetic bandgap (EBG) structures for noise suppression in power/ground plane applications. We have established the design rules for EBG using finite-element based parametric analysis and extraction of the equivalent circuit models for EBG. The concept can be applied to achieve desired operating frequencies and dimensions, by tuning values...
Advancement in semiconductor technologies including CMOS and SiGe is enabling the commercialisation of devices that have increased switching speed, reduced power supply and increased circuit complexity. Proliferation of high-speed systems in both digital and mixed-signal applications is also driving the need for advanced noise suppression techniques. This paper describes a novel approach of using...
Recently, the timing control of high-frequency signals is strongly demanded due to the high integration density in three-dimensional (3D) LTCC-based SiP applications. Therefore, to control the skew or timing delay, new 3D delay lines will be proposed. For frailty of the signal via, we adopt the concept of coaxial line and proposed an advanced signal via structure with quasi coaxial ground (QCOX-GND)...
The heating element with different configurations has been designed and fabricated by the screen printing approach using the conductive silver ink XZ250 with resistivity of 30 muOmegaldrcm. Thermal and electrical performances of screen printed heating element were evaluated at different electrical input power and certain ambient temperature. The printed heater can heat up temperature 85degC at input...
In this paper we propose to integrate two antennas in an IC package that carries the 60-GHz radio chip sets. The antennas realized in this manner are simply called as AiP (antenna-in-package). AiP are radically different as compared with the integrated and chip antenna solutions. The AiP solution offers the possibility to combine antennas with a highly integrated 60-GHz radio into a compact standard...
The demand for smaller size with increased functionality in electronic devices require new materials, which will allow integration of passives elements in substrate. Low temperature co-fired ceramic (LTCC) is a glass ceramic substrate technology that offers an excellent platform for multi-functional integration. This paper describes manufacturing challenges in co-sintering of composite dielectric...
Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad range of applications including filtering, tuning and power-bus decoupling. This paper presents the performance characterization...
Low temperature co-fired ceramic (LTCC) technology is the preferred platform for integrating multi-layer capacitors due to excellent high frequency performance and low-loss dielectric properties. This letter describes an approach to perform modeling of multi-layer capacitors in LTCC technology. This hybrid approach combines both analytical modeling and numerical modeling to provide a scalable circuit...
Low temperature cofired ceramic technology (LTCC) is a substrate platform that provides true 3D integration whilst satisfying very high frequency performance requirements with good thermal characteristics. This paper describes the modeling and characterization of multilayer capacitor integration for rf applications
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.