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Embedded passives account for a very large part of today's electronic assemblies. This is particularly true for products such as cellular phones, camcorders, computers and several critical defense devices. Market pressures for new products with more features, smaller size and lower cost demand smaller, compact, simpler substrates. An obvious strategy is to reduce the number of surface mounted passives...
The demand for system miniaturization in many applications has lead to efforts to put all or most of the functions on a single chip. However, there are many situations where this is not possible or cost prohibitive. Memory uses large amounts of chip area and several different memory types may be needed to fulfill the functional requirements. In many cases, the need for analog and digital functions...
This paper discusses thin film technology based on resin coated copper capacitive (RC3) nanocomposites. In particular, we highlight recent developments on high capacitance, large area, thin film passives, their integration in printed wiring boards (PWB), system in package (SiP) and chip package substrates and the reliability of the embedded capacitors. A variety of RC3 nanocomposite thin films ranging...
The speed of differential digital signals, such as 12.5 Gb/s, have increased enough to be degraded by semiconductor packaging features which are ignored at lower frequencies. In addition, more and more signals need to communicate in and out of the die. Several multi-gigabit industry bus standards, like Hyper Transport, Infmiband, PCI Express, Rapid IO and SATA, are driving new speed and density specifications...
Greater I/O density at the die level, coupled with more demanding performance requirements, is driving the need for improved wiring density and a concomitant reduction in feature sizes for electronic packages. Traditionally, greater wiring densities are achieved by reducing the dimensions of vias, lines, and spaces, increasing the number of wiring layers, and utilizing blind and buried vias. However,...
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