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The successful optimization and characterization of a deep trench isolation in a thick SOI process for operating voltages up to 650 V is reported. Different technologies were investigated to optimize the mechanical stress during wafer processing and to increase the breakdown voltage of a single trench configuration. Comprehensive electrical characterization was done to investigate achievable operating...
Deep trenches for device insulation in a high-voltage process in thick SOI were fabricated using different manufacturing technologies. The trenches have been investigated by current-voltage-characteristics. In comparison to the conventional produced trenches alternatively fabricated samples reach a remarkable increase of the breakdown voltages accompanied by a decline of the leakage current in the...
The long term isolation properties of deep trenches in thick SOI have been investigated by current-voltage- characteristics. A strong change of the measured trench leakage current was observed depending on the applied voltage. Further on a marked decrease of the leakage current was observed depending on the duration and polarity of the applied stress. The improvement of the formatted trench isolation...
System-in-package integration becomes more and more important in the growing market of micromechanical sensors and actuators. The most important group of actuators are those based on the electrostatic working principle. Because of the high voltages used to drive these actuators, new methods of isolation need to be introduced. In this paper we will characterize and model the electrical behavior of...
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