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Achieving required performance, quality and reliability is a key factor for the success and adoption of 3D printing technology in electronics manufacturing applications. This paper details the currents status of 3D-Printing with regards different technologies and their potential use in electronic manufacturing and packaging. The paper also presents modelling methodologies and toolsets that can help...
3D-Printing, or Additive Manufacturing, has received significant media attention during the last five years. A number of companies are now commercializing materials, design tools, and 3D-Printers and these are being used in a number of sectors for digital manufacturing including aerospace, medical, construction and consumer products. But what impact is 3D-Printing having on electronic packaging and...
In this paper, an autonomous thermal management design process based on a topological optimisation algorithm is presented. The numerical framework uses a finite element multiphysics solver to assess fluid flow and heat transfer, coupled with the Method of Moving Asymptotes approach for topology optimisation. The design framework is utilised to develop a copper heatsink for a simplified electronics...
In this paper, a computational approach for the analysis of microscale droplet impact dynamics is presented. The approach is intended to support a condition based monitoring system to enhance quality and reliability of inkjet printed electronics components. The Smoothed Particle Hydrodynamics (SPH) approach of Lucy and Gingold and Monaghan has been used as the basis for the model, with the 5-SPH terms...
Achieving required performance, quality and reliability are key factors for the success and adoption of 3D printing technology in electronics manufacturing applications. This paper details the current status of 3D-Printing with regards different processes and technologies and their potential use for electronics manufacturing and packaging. The paper also presents design and modelling methodologies...
An inverse analysis approach combining numerical and experimental analyses has been utilised to determine the in-situ effective material properties of Highly Oriented Pyrolytic Graphite (HOPG) in a microelectronics test assembly. The approach adopted uses a Finite Element analysis package to determine temperature distribution over a thermal test assembly. A Virtual Design of Experiments approach is...
An approach to curing thermosetting polymers is the use of Variable Frequency Microwave (VFM) systems, which have been shown to cure encapsulant materials in substantially shorter times than conventional methods [1]. The microwave curing of thermosetting polymer material is a complex process, with interactions between electromagnetic field intensity, temperature, polymer cure kinetics and resulting...
The accuracy of four widely used cure kinetics models in predicting the cure rate of a commercially available encapsulant material is assessed. Four nth order phenomenological cure kinetics models and the single step autocatalytic model are outlined. These models are fitted to Differential Scanning Calorimetry data using two differing approaches. The Borchardt-Daniels approach is outlined and utilised...
An open-ended single mode resonant microwave applicator has been developed for the curing of encapsulants materials used for microelectronic packaging. Post cure behaviour of Henkel™ E01080 encapsulant material has been studied by Differential Scanning Calorimetry (DSC), Attenuated Total Reflectance Fourier-Transform Infrared (ATR-FTIR) analysis and Dynamic Mechanical Analysis (DMA). DSC based measurement...
An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer...
In microelectronics packaging applications a variety of thermosetting polymer materials is applied. Such materials are dispensed in a liquid form and are heated with the intent to cure them. Conventional processes often take several hours to bring the material up to temperatures which result in a significant rate of cure. An alternative approach to curing thermosetting polymers is the use of microwave...
This work assesses the accuracy of specific numerical models in predicting the cure kinetics of a commercially available isotropic conductive adhesive material. A series of Differential Scanning Calorimetry (DSC) analyses have been performed on the materials to determine fundamental cure data. Cure models have been fitted to these experimental data using both the traditional and Particle Swarm Optimization...
Microwave cure of thermosetting polymer underfill material in a simplified ball grid array package is assessed using a multiphysics analysis approach. A dual section microwave oven system capable of heating individual surface mount components on a printed circuit board assembly is described and its integration into a microelectronics manufacturing line is briefly outlined. Due to the complexity of...
The electrical and thermomechanical properties of isotropic conductive adhesive materials vary significantly during the material cure process as polymer crosslinking alters the molecular structure and volume of the material which, in turn, alters the percolation threshold causing step changes in the values of electrical and thermal conductivity within the material. It is therefore important to ensure...
An enhanced open ended waveguide cavity oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor...
Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature...
A review of polymer cure models used in microelectronics packaging applications reveals no clear consensus of the chemical rate constants for the cure reactions, or even of an effective model. The problem lies in the contrast between the actual cure process, which involves a sequence of distinct chemical reactions, and the models, which typically assume only one, (or two with some restrictions on...
Power electronics uses semiconductor technology the convert and transmit energy. Power electronics modules such are the core electronic packages that undertake this function. The take up of these technologies is growing dramatically due to the increase in electronics in sectors such as automobiles, aerospace, consumer white goods, and of course green technologies. Designing such modules requires a...
The use of an innovative jet impingement cooling system in a power electronics application is investigated using numerical analysis. The jet impingement system, outlined by Skuriat et al, consists of a series of cells each containing an array of holes. Cooling fluid is forced through the device, forming an array of impingement jets. The jets are arranged in a manner, which induces a high degree of...
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