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The following topics are dealt with: MEMS/MOEMS; numerical simulation and modelling; reliability and testing; RF MEMS; sensors; compact and behavioral modelling; actuators; CAD; microfabrication, integration and packaging; embossing and mould; large area manufacturing; value and packaging; assembly and packaging; control and read-out architectures for MEMS and NEMS.
Molecular dynamics simulation has been used to study mechanical properties of gold nanowires. For this purpose, stress-strain behavior of Au nanowires under different loading conditions has been investigated. Nanowires were subjected to uniaxial strain at temperature of 50,300 and 400 K using embedded atom model potential. Moreover, the effect of temperature on Young's modulus of nanowire has been...
In this paper, we investigate the impact of packaging on the behavior of MEMS convective accelerometers. The objective is to identify the influence of package dimensions on system performances to develop in a close future a compact model that integrates those influences. Experiments are based on FEM simulations and results are discussed with respect to the package height, the package shape and the...
This paper presents the limitations of the helium leak test when applied to typical MEMS packages. Hermeticity testing using FTIR and Raman spectroscopy are investigated with a view to overcoming the limitations of the helium leak test method. Hermeticity testing using FTIR is successful demonstrated for low cavity volume MEMS and glass packaged devices. Raman spectroscopy also improves on these limitations...
MEMS can be exposed to shock loadings, since they are often designed for portable devices. We recently investigated the effects of shocks on polysilicon inertial MEMS sensors within the framework of a top-down, uncoupled multi-scale approach, explicitly exploring three length-scales: a macroscopic one (package length-scale); a mesoscopic one (sensor length-scale); and a microscopic one (polycrystal...
In order to realize the evaluation of electrical properties of materials in nanoscale orders, a method for the measurement of local conductivity was presented. A microwave atomic force microscope (M-AFM) probe in which microwave signals can propagate was fabricated. An open structure of a waveguide at the tip of the probe was introduced by focused ion beam (FIB) fabrication. The microwave measurement...
This paper presents the analysis, design and simulation of an all metal in line series ohmic RF MEMS switch. The proposed switch is indented to be used in the frequency range between DC and 10GHz. The switching characteristics of the proposed switch fulfill all the requirements as concerns loss, isolation, linearity, power handling and small size/power consumption. The specific design of the cantilever...
Wide range tuneable components are a key point for High Frequency performances. We have developed a novel RF MEMS Capacitor based on surface variation and high displacement. This paper will present multiple Designs with physical parameter variations for comparative test with Fabricated Device Measurements. The goal of this work is to define a good approximation of the measures to further design devices...
Electro-statically driven micro-mechanical structures are an interesting and frequently used category of MEMS elements. Investigation of their properties is important both for better understanding the device operation and for fault detection and diagnosis. To follow the movement of micro-parts in such elements involves difficulties since device packages inhibit looking into the chip. Our motivation...
This paper addresses the design of CMOS High-Voltage drivers for the actuation of MEMS relays with pull-in voltage in the 20-50V range. So-called “Smart Drivers” have been developed using a standard High-Voltage CMOS technology. These drivers provide the required high voltage for the MEMS actuation and integrate a diagnosis ability to determine whether the pull-in occurs during the actuation process...
Flow sensor arrays can be used to extract features from flow fields rather than averaging or providing local measurements provided the sensors in the array structure can be interrogated individually. This paper addresses the latest developments in fabrication and array interfacing of biomimetic artificial air-flow sensors. Hair flow sensors in wafer level arrays have been successfully fabricated using...
This paper presents the detailed design, working principle and testing of a thermally independent irradiation solar sensor. The sensor is based on a photoelectric cell, and incorporates a sensor circuit which assures proper short circuit conditions and accomplishes temperature compensation as well. Our sensor sensitivity is 3 mV/W/m2 and resolution is 0.5 W/m2. Mean error of the compensated output...
Hyperthermia affects certain regulatory proteins, kinases or cyclins, resulting in alternations to the cell cycle and even to apoptosis. Damage to the cell plasma membrane is a key factor in the killing of a cell by hyperthermia. Analysis at the single-cell level is necessary for understanding the fundamental mechanisms of hyperthermia-induced cell death and the generation of thermotolerance in surviving...
Magnetic field microsensors based on the magneto-impedance phenomenon have been fabricated by stacking up ferromagnetic/conductive/ferromagnetic films. Their sensitivity is in the same range than macroscopic devices (i.e. 400 V/T/A) and is constant from 0 to 500 A m-1. The ferromagnetic layer is a Finemet® alloy. Initially an amorphous material, it is nanocrystallized by heat treatment. Its magnetic...
We present a dual axis accelerometer made with a frontside bulk micromachining on a 0.35 μm CMOS. The accelerometer is based on thermal convection where a central heater creates a hot gas bubble. Acceleration applied to the body will change the temperature distribution on the device, the latter being measured by four detectors containing six serially connected thermocouples. The paper will present...
This paper studies the vibration energy harvesting (VEH) capabilities for one electrostatic mechanism: the out-of-plane gap-closing (OPGC) converter. The goal is to maximize the output energy harvested from a MEMS device while preventing the integrity of the conditioning circuit. The originality of this work lies in the optimization taking into account both electrical and mechanical aspects and studying...
This study applies energy method to derive the system modeling of a tri-axial micro-accelerometer that consists of a quadri-beam suspension, a seismic mass, and displacement transducers using piezoelectric thin films. Two suspension beams support both ends of the seismic mass, which is fabricated by anisotropic etching of silicon. An out-of-plane acceleration will result in a symmetric bend, and in-plane...
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