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The design, fabrication and characterization of an electrostatic-type bi-axial MEMS scanning mirror operating with inter-digitated comb fingers are presented. The effect of comb offset on device actuation is examined. In addition to standard designs with and without comb offset, a novel asymmetric mirror plate was designed to introduce an imbalance. It was found that all the three designs can be actuated...
As the demands for high-density, high-speed, high-performance, and multi-function in portable electronic products, packaging technologies require significant improvement to bring out ICs' performance and shrink the total module or package size. One representative technology is to embed active devices into an organic substrate by sequential build-up processes, for example, chip-in-polymer by IZM, bumpless...
The structure of chip-in-substrate package, CiSP, is shown. The thin chips (50mum) are bonded on the organic substrate (BT) flatly. Subsequently, the chips are covered among the build-up dielectric layer, which can be either a RCC (resin coated copper) material or an organic dielectric material (ABF) by a lamination process. Via holes on the chip's I/O pad and substrate are drilled by laser. The interconnection...
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